Author's Latest Posts


What’s Missing In Advanced Packaging


Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

System Bits: Dec. 20


Removing quasiparticles from superconducting quantum circuits improves lifetime Given that an important prerequisite for the realization of high-performance quantum computers is that the stored data should remain intact for as long as possible, an international team of scientists at European interdisciplinary research institute Forschungszentrum Jülich has succeeded in making further improvem... » read more

System Bits: Dec. 13


Data, code sharing standards for computational studies While reporting new research results involves detailed descriptions of methods and materials used in an experiment, when a study uses computers to analyze data, create models or simulate things that can’t be tested in a lab, how can other researchers see what steps were taken or potentially reproduce results? To this end, a new report by... » read more

Embedded Software Verification Issues Grow


Embedded software is becoming more critical in managing the power and performance of complex designs, but so far there is no consensus about the best way to approach it—and that's creating problems. Even with safety-critical standards such as DO-178C for aerospace and [gettech id="31076" comment="ISO 26262"] for automotive, different groups of tool providers approach software from differen... » read more

Analog’s Rising Status


As more sensors and actuators are added into electronic devices, pressure is growing to more seamlessly move data seamlessly back and forth between analog and digital circuitry. [getkc id="37" kc_name="Analog"] and digital always have fit rather uncomfortably together, and that discomfort has grown as [getkc id="81" kc_name="SoCs"] are built using smaller feature sizes. While digital transis... » read more

System Bits: Dec. 6


Teaching computers to read A multidisciplinary team of UCLA researchers has built a computational model that reflects how humans think and communicate, by designing an algorithm that examined nearly two million posts from popular parenting websites, thereby teaching computers to understand structured narratives within the flow of posts on the internet. Managing large-scale data in this way ... » read more

Car Becomes A Living Platform


Future generations of vehicles will age like any other electronic or mechanical devices, but they also will need to adapt, grow, and change in unexpected ways over time to avoid being hacked, rendered obsolete, or otherwise compromised. This adds a whole new set of challenges never seen before in automotive development, and OEMs are working feverishly to bring system architectures up to ... » read more

Can Startups Solve Today’s Automotive Challenges?


When asked about the most pressing concerns today amongst automotive customers, some leading industry suppliers had the following to say: Samer Hijazi, senior design engineering architect, IP Group at Cadence: How fast can I deploy? Ron DiGiuseppe, Senior Strategic Marketing Manager at Synopsys: Our customers are very broadly requiring ISO26262 safety compliance in our products as well a... » read more

Optimizing Multiple IoT Layers


As the number of connected devices rises, so do questions about how to optimize them for target markets, how to ensure they play nicely together, and how to bring them to market quickly and inexpensively. [getkc id="76" kc_name="IoT"] is broad term that encompasses a lot of disparate pieces for devices, systems, and connected systems. At the highest levels are hardware and software, but with... » read more

System Bits: Nov. 29


Qubit device fabbed in standard CMOS In a major step toward commercialization of quantum computing, Leti, an institute of CEA Tech, along with Inac, a fundamental research division of CEA, and the University of Grenoble Alpes have achieved the first demonstration of a quantum-dot-based spin qubit using a device fabricated on a 300-mm CMOS fab line. Maud Vinet, Leti’s advanced CMOS manager... » read more

← Older posts Newer posts →