Author's Latest Posts


When Digital, Physical Worlds Merge


Semiconductor Engineering sat down with Simon Segars, [getentity id="22186" e_name="ARM's"] CEO, and [getperson id="11764" comment="Lucio Lanza"], managing partner of Lanza techVentures, to talk about changes in the IoT, self-driving vehicles, cloud-based health monitoring, and the impact of machine learning. What follows are excerpts of this conversation. SE: Several years ago the [getkc i... » read more

EDA Moves Out Of The Shadows


EDA has long harbored ambitions that are larger than a piece of silicon. The engineering challenges being solved on a nanometric scale are remarkably similar to ones being solved at a much higher level—architectural design, layout, validation, verification, debug, thermal mapping, and a lot more. The problem, at least until recently, is that it has been difficult to gain a foothold in larg... » read more

Verification In The Cloud


By Ed Sperling Leasing of cloud-based verification resources on an as-needed basis is finally beginning to gain traction after more than a decade of false starts and over-optimistic expectations. All of the major EDA vendors now offer cloud-based services. They view this as a way of either supplementing a chipmaker's existing resources at various peak use times, or for small and midsize com... » read more

Verification And The IoT


Semiconductor Engineering sat down to discuss what impact the IoT will have on the design cycle, with Christopher Lawless, director of external customer acceleration in [getentity id="22846" e_name="Intel"]'s Software Services Group; David Lacey, design and verification technologist at Hewlett Packard Enterprise; Jim Hogan, managing partner at Vista Ventures; Frank Schirrmeister, senior group d... » read more

Safety Plus Security: Solutions And Methodologies


By Ed Sperling & Brian Bailey As more technology makes its way into safety-critical markets—and as more of those devices are connected to the Internet—security issues are beginning to merge with safety issues. The number of attempted cyberattacks is up on every front, which has big implications for devices used in safety-related applications. There are more viruses, ransomware, an... » read more

Connecting The Car


K. Charles Janac, chairman and CEO of ArterisIP, sat down with Semiconductor Engineering to discuss changes in automotive and how the connected car will affect chip design and a multitude of other markets. What follows are excerpts of that conversation. SE: What is the biggest change you're seeing in semiconductors? Janac: The really big change is that mobility is flattening out. The mark... » read more

Tech Talk: 7nm Power


Annapoorna Krishnaswamy, lead applications engineer at ANSYS, talks with Semiconductor Engineering about power-related changes at 7nm and what engineering teams need to watch out for as they move down to the latest process technology. https://youtu.be/Ym46ssJPeHM » read more

Shrink Or Package?


Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around this shift, the reality is that it has taken more than a half-century to materialize. Advanced [getkc id="27" kc_name="packaging"] began with IBM flip chips in the 1960s, and it got another boost ... » read more

Architecture First, Node Second


What a difference a node makes. A couple of rather important changes have occurred in the move from 16/14 to 10/7nm (aside from more confusing naming conventions). First, companies that require more transistors—processor companies such as [getentity id="22846" e_name="Intel"], AMD, [getentity id="22306" comment="IBM"] and [getentity id="22676" e_name="Qualcomm"]—have come to grips with t... » read more

Tech Talk: ISO 26262


Arteris' Kurt Shuler discusses what's changing in the automotive standard and how everything is supposed to work in the future. » read more

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