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EEMBC Offers Benchmark for Bluetooth LE in IoT


The Embedded Microprocessor Benchmark Consortium is introducing the IoTMark-BLE benchmark, for certifying the performance of devices using the Bluetooth Low Energy wireless protocol for Internet of Things applications. It is the first in the group’s IoT-Connect benchmark series. EEMBC also is preparing the ULPBench 2.0 standard, which will test the ultra-low-power capabilities of connected... » read more

The Week In Review: IoT


Services AT&T and IBM are expanding their joint Internet of Things effort to offer AT&T’s new IoT analytics capability, helping customers yield insights from their industrial IoT data. The capability takes in AT&T’s M2X, Flow Designer, Control Center, and other IoT offerings; IBM Watson IoT; the IBM Watson Data Platform; and the IBM Machine Learning Service, part of Watson Data Platform on... » read more

The Week In Review: IoT


Government Maureen Ohlhausen, the acting head of the Federal Trade Commission, said in an interview that she looks to manufacturers of Internet-connected devices to decide on best practices for the Internet of Things. Although the FTC has the legal authority to set regulations for a variety of industries, Ohlhausen said the commission is “not primarily a regulator,” in line with the new ad... » read more

The Week In Review: IoT


Products NASA this week deployed its latest Technology Educational Satellite, TechEdSat-5, from the International Space Station. The satellite, said to be about the size of a fire extinguisher, will provide wireless data communications for ISS payloads and other satellites. TechEdSat-5 has Digi XBee 802.15.4 modules from Digi International to use in the test program. Flexpoint Sensor System... » read more

A Brief History of Test


The history of semiconductor test systems is the subject of this blog post. We’ll turn to printed circuit board testing at another time. Boston-based Teradyne sold its D133 diode tester to Raytheon in 1961. Five years later, it introduced the J259 integrated circuit tester, which had a minicomputer to run the test programs. For many, this marks the beginning of automatic (or automated) tes... » read more

2.5D Adds Test Challenges


OSATs and ATE vendors are making progress in determining what works and what doesn't in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. A [getkc id="82" kc_name="2.5D"] package generally includes an ASIC connected to a stack of memory chips—usually high-bandwidth memory—using an [getkc id="204" kc_name="interposer"] or some type of silicon bri... » read more

The Week In Review: IoT


Conferences The number of IoT and IoT-related conferences continues to grow, but IoT also is beginning to make inroads into established conferences. The Mobile World Congress, held this week in Barcelona, Spain, teemed with Internet of Things announcements from many companies. SEMICON Southeast Asia, scheduled for April 25-27 at SPICE in Penang, Malaysia, will feature the World of IoT: Futur... » read more

Big Data On Wheels


By Jeff Dorsch & Ed Sperling All kinds of chips are going into driver-assisted and autonomous cars. On one side are arrays of sensors, which are generating huge amounts of data about everything from lane position and proximity to other cars to unexpected objects in the road. On the other side are the chips required to process that data at blazing speed. As the market for PCs and mobil... » read more

The Week In Review: IoT


M&A ARM Holdings this week announced the acquisition of two firms, Mistbase and NextG-Com, to help bring narrowband Internet of Things technology to its chip designs. In addition, the company announced the development of ARM Cordio-N radios to reduce the complexity of adopting cellular IoT connectivity. Meanwhile, Blu Wireless Technology of the U.K. reported that ARM made an equity investment ... » read more

The Week In Review: IoT


Consortia Optimal+ said this week that it has joined the Industrial Internet Consortium. “The Industrial Internet of Things (IIoT) will have a tremendous impact on industries worldwide. The application of smart manufacturing, combined with the collection and analysis of in-use/field stage data, will deliver powerful insights to brand owners and enable them to achieve dramatic improvements in... » read more

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