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The Week in Review: IoT


Commentary Chris Voce of Forrester Research writes that the Internet of Things next year will move beyond experimentation in this piece. “At Forrester we believe IoT extends beyond devices and connectivity,” he writes. “But it's the business impact of IoT that truly defines what it is: the insights that you can derive with analytics and the business outcomes you can achieve.” M&A M... » read more

The Week in Review: IoT


Investment The city of Dresden, Germany, is touting its prospects as a tech hub in the “Silicon Saxony” ecosystem, particularly for Internet of Things technology. Bosch, the German Aerospace Center, GlobalFoundries, Infineon Technologies, and other organizations are planning to invest about €4.5 billion (approximately $5.3 billion) over several years to develop processors, sensors, and 5... » read more

The Week in Review: IoT


Security Mocana said it is working with Avnet, Infineon Technologies, Microsoft, and Xilinx to provide Industrial Internet of Things systems that meet cybersecurity standards. The systems utilize the Avnet UltraZed-EG system-on-module, Mocana’s security software running on the Xilinx Zynq Ultrascale+ MPSoc, and Infineon’s OPTIGA Trusted Platform Module 2.0 security chip. The Microsoft Azur... » read more

2017 ITC Wrap-up


Advantest was among the exhibitors and corporate sponsors at last week’s 2017 International Test Conference in Fort Worth, Texas. The automatic test equipment company also presented papers, took part in sessions, and provided posters during ITC’s technical program. In the booth, Advantest demonstrated its on-demand CloudTesting Service. It also showed off its EVA100 analog/mixed-signal IC t... » read more

Where MEMS Can Boldly Go Now


MEMS chips are being designed to go into the human body as biosensors, which will require unique packaging. And as demand grows for assisted and automated driving, MEMS devices also are finding new use cases in automotive electronics, their chief market segment prior to the millennium. Pressure sensors, such as those that monitor the air pressure in tires, remain the biggest type of [getkc i... » read more

The Week in Review: IoT


Finance Farmobile has raised $18.1 million in a Series B round of funding, led by Anterra Capital and AmTrust Agricultural Insurance Services, bringing its total funding to more than $28 million. Existing investors also took part in the new round. The agricultural Internet of Things startup will use the money to expand its operations around the world. Farmobile provides agronomic and machine d... » read more

Security For Embedded Electronics


The embedded systems market is expected to enjoy steady growth in the near future—provided those systems can be adequately secured. One of the biggest challenges for embedded devices and systems, especially those employed in the [getkc id="76" comment="Internet of Things"], is adequately protecting them from increasingly sophisticated hacking. This is a new tool for criminal enterprises, a... » read more

The Week in Review: IoT


Finance Automile, an Internet of Things company involved in field-service businesses, has received $34 million in Series B funding led by Insight Venture Partners, bringing its total funding to $47 million. Existing investors Dawn Capital, Point Nine Capital, SaaStr Fund, and Salesforce Ventures also participated in the new round. Automile will use the money on marketing, product developmen... » read more

The Week in Review: IoT


Acquisitions ASSA ABLOY has agreed to acquire August Home, a startup providing home security products; the purchase price wasn’t revealed. August Home, which raised $75 million in private funding, should fit well with the Scandinavian conglomerate’s Yale lock business. The transaction is subject to regulatory approval and customary closing conditions; it is expected to close by the end of ... » read more

Memory Test Challenges, Opportunities


The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

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