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Time For Massively Parallel Testing


Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

Looking Back at Board Test


Printed circuit board testing has been around as long as printed circuit boards, also known as printed circuit assemblies and printed wiring boards. PCB technology started in the early 20th century with Thomas Edison and other inventors. As boards shrink to fit inside wearable gadgets and other products with compact form factors, PCB test equipment vendors are addressing new challenges. Boar... » read more

How Testing MEMS, Sensors Is Different


When it comes to testing microelectromechanical system devices and sensors, sometimes you have to shake and bake. [getkc id="311" comment="MEMS"] and [getkc id="187" kc_name="sensors"] are physically different from standard ICs. They require a specific type of stimulus to get the required testing results. Most chips only need to have an electrical charge run through them to gauge their pass/... » read more

The Week In Review: IoT


Mergers & Acquisitions Qualcomm reported that the waiting period under the Hart-Scott-Rodino Antitrust Improvements Act of 1976 expired on Monday, April 3, clearing the chip design company’s proposed $47 billion acquisition of NXP Semiconductors, at least in the eyes of U.S. antitrust regulators. Qualcomm expects to close the transaction, which will create an Internet of Things powerhouse, b... » read more

LiDAR Completes Sensing Triumvirate


Fully autonomous vehicles of the future will depend on a combination of different sensing technologies – advanced vision systems, radar, and light imaging, detection, and ranging (LiDAR). Of the three, LiDAR is now the costliest part of that equation, and there are worldwide efforts to bring down those costs. Mechanical LiDAR units are currently available, priced in the hundreds of dollars... » read more

The Week In Review: IoT


Products NXP Semiconductors this week brought out several Internet of Things devices and other products for using near-field communications in advanced product authentication, integrity assurance, and enhanced user engagement in consumer manufactured goods, health care, retail, and other industries. The company has introduced the NTAG 413 DNA and NTAG 213 Tag Tamper devices to combat fake prod... » read more

EEMBC Offers Benchmark for Bluetooth LE in IoT


The Embedded Microprocessor Benchmark Consortium is introducing the IoTMark-BLE benchmark, for certifying the performance of devices using the Bluetooth Low Energy wireless protocol for Internet of Things applications. It is the first in the group’s IoT-Connect benchmark series. EEMBC also is preparing the ULPBench 2.0 standard, which will test the ultra-low-power capabilities of connected... » read more

The Week In Review: IoT


Services AT&T and IBM are expanding their joint Internet of Things effort to offer AT&T’s new IoT analytics capability, helping customers yield insights from their industrial IoT data. The capability takes in AT&T’s M2X, Flow Designer, Control Center, and other IoT offerings; IBM Watson IoT; the IBM Watson Data Platform; and the IBM Machine Learning Service, part of Watson Data Platform on... » read more

The Week In Review: IoT


Government Maureen Ohlhausen, the acting head of the Federal Trade Commission, said in an interview that she looks to manufacturers of Internet-connected devices to decide on best practices for the Internet of Things. Although the FTC has the legal authority to set regulations for a variety of industries, Ohlhausen said the commission is “not primarily a regulator,” in line with the new ad... » read more

The Week In Review: IoT


Products NASA this week deployed its latest Technology Educational Satellite, TechEdSat-5, from the International Space Station. The satellite, said to be about the size of a fire extinguisher, will provide wireless data communications for ISS payloads and other satellites. TechEdSat-5 has Digi XBee 802.15.4 modules from Digi International to use in the test program. Flexpoint Sensor System... » read more

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