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The Week In Review: Design


M&A ARM reached further into the HPC space with its acquisition of Allinea Software, a provider of debug and performance analysis tools for HPC systems. Currently, 80% of the world's top 25 supercomputers use Allinea's tools, and ARM will continue supporting multiple processor architectures. Terms of the deal were not disclosed. PLDA Group is spinning out its QuickPlay C/C++ tool for ... » read more

Blog Review: Dec. 21


Mentor's Jeff Miller and ARM's Nandan Nayampally contend that it's easier than ever to design custom SoCs. Cadence's Paul McLellan provides a basic primer on silicon photonics, from a presentation by Gilles Lamant. The US Department of Transportation is considering requiring the inclusion of vehicle-to-vehicle communication in new cars, says Synopsys' Robert Vamosi. Applied's Shekar Kr... » read more

Power/Performance Bits: Dec. 20


Stamping with electronic ink Engineers at MIT fabricated a stamp made from carbon nanotubes that is able to print electronic inks onto rigid and flexible surfaces. The team's stamping process should be able to print transistors small enough to control individual pixels in high-resolution displays and touchscreens, said A. John Hart, associate professor of contemporary technology and mecha... » read more

The Week In Review: Design


IP eSilicon launched 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY. It supports up to 256Gbytes/sec bandwidth with 8x128b channels at 2Gbps per I/O, and the integrated I/O supports up to 2Gbps DDR operation across a 4mm interposer channel. The PHY was developed on Samsung 14LPP and TSMC 28HPC technologies. Flex Logix designed a high-performance embedded FPGA IP core for TSMC 16FF+ and... » read more

Blog Review: Dec. 14


What are the technology options for 5nm? Cadence's Paul McLellan highlights an IEDM presentation by An Steegen of Imec. Synopsys' Michael Posner suggests we may not have to live with USB Type-C dongles for very long. Mentor's Craig Armenti presents some of the fundamental best practices and guidelines for rigid-flex PCB design. NXP's Joe Byrne digs into the Mirai botnet attack, arguing... » read more

Power/Performance Bits: Dec. 13


3D porous microsupercapacitors A research team from the King Abdullah University of Science and Technology (KAUST) developed an integrated microsupercapacitor targeted at self-powered system applications where the power source may be intermittent, such as sensors for wearables, security, and structural health monitoring. The key to the microsupercapacitors is vertically-scaled three-dimen... » read more

The Week In Review: Design


Standards The latest version of the Bluetooth standard was ratified by the Bluetooth Special Interest Group. Key updates in Bluetooth 5 include four times range, two times speed, and eight times broadcast message capacity, as well as updates that help reduce potential interference with other wireless technologies. Tools Synopsys updated its hierarchical static timing analysis tool for ... » read more

Blog Review: Dec. 7


Mentor's Harry Foster looks at verification results findings in terms of schedules, number of required spins, and classification of functional bugs, in the latest installment of the Wilson Research Group verification study. Cadence's Paul McLellan provides an overview of the portable stimulus standard currently being worked on at Accellera. Synopsys' Anika Malhotra checks out JESD204B, a ... » read more

Power/Performance Bits: Dec. 6


Perovskites for data storage Scientists at EPFL developed a new perovskite material whose magnetic order can be rapidly changed without disrupting it due to heating that could potentially be used to build next-generation hard drives. "We have essentially discovered the first magnetic photoconductor," said Bálint Náfrádi, a postdoc at EPFL. This new crystal structure combines the advant... » read more

The Week In Review: Design


Deals Kilopass extended its deal with ICScape, which makes a Parallel SPICE simulator, for eNVM IP at advanced finFET nodes. Kilopass has been working with ICScape for the past couple of years as part of its qualification methodology. IP Silvaco released three MIPI I3C sensor controller IP cores. Developed with NXP to push adoption of I3C, the new products are an Advanced Slave core wi... » read more

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