USB specifications; memory in China; custom cars; electronic skin; building a demo; IoT security; RF-SOI.
Synopsys’ Michael Posner digs into the relationships between USB Type-C, USB 3.1, Power Delivery and DisplayPort specifications.
Cadence’s Paul McLellan listens in on a discussion of the memory market’s growth in China, and what’s on the horizon.
Mentor’s Andy Macleod looks at the challenges that come with the increased car customization consumers are demanding.
An energy-harvesting, transparent electronic skin has been developed, bringing prosthetics with a sense of touch a step closer in this week’s top five tech picks from Ansys’ Justin Nescott. Plus, Polaroids are back and a tumor-detecting scalpel.
ARM’s Edd Duthie details the process of creating the Sensors to Servers demo which collects and visualizes live data from near ARM trade show booths.
The IoT will be the next big market for cyber security, says Rambus’ Aharon Etengoff, with mandatory government regulations a driving force.
GlobalFoundries’ Peter A. Rabbeni looks at the impact of RF-SOI in the mobile market in anticipation of 5G networks.
NXP’s Charles Dachs has an idea of what a trip on mass transit could look like with mobile integration.
Mentor’s Colin Walls provides a little history on the difference between RISC and CISC architectures.
Cadence’s Efrat Shneydor investigates how to build a more efficient scoreboard in e.
Connected trucks may be the key to getting autonomous cars on the road as the EU considers changes to legislation to make self-driving cars a reality in Europe, says Synopsys’ Robert Vamosi.
And don’t forget the blogs featured in last week’s Low Power-High Performance newsletter:
Editor In Chief Ed Sperling contends that compute architectures will start wrapping around the memory rather than the processor.
Executive Editor Ann Steffora Mutschler finds a lot of emphasis being placed on power modeling, despite lingering concerns.
ARM’s Charles Dittmer and Prithi Ramakrishnan question whether we can get to Bluetooth without batteries.
Teklatech’s Tobias Bjerregaard looks at silicon measurements that are relevant to IoT designs.
Mentor Graphics’ Ellie Burns observes that dynamic power becomes the dominant contributor to power consumption as designs move to finFET technology.
Synopsys’ Marc Greenberg notes that to deploy LPDDR4 effectively requires an understanding of the fundamental changes in its architecture.