Technology pioneers; diamonds and balloons; TSMC in 3D; Y2K all over again; memory evolution; cars and starlings.
To celebrate ARM’s 25th birthday, Neil Cooper teamed up with the Science Museum in London to feature 25 people or objects that were pivotal to the creation of modern technology. This week: James Clerk Maxwell and Heinrich Hertz.
Ansys’ Bill Vandermark delves deep into the oceans with energy-storing balloons and up to the sky on a diamond thread in his top technology and engineering articles of the week. Plus, Li-Fi is here, and it’s fast.
Do you know the differences between TSMC’s two different 3D packaging technologies? Cadence’s Paul McLellan digs into the details, and whether the latest could enable 3D ICs to truly arrive in volume.
Think the Y2K problem is over? No so fast, says Mentor’s Colin Walls in a new video.
In a webinar, Synopsys’ Nasib Naser presents the evolution of memory technology leading to the latest developments in DDR, LPDDR, eMMC, High Bandwidth Memory and Hybrid Memory Cubem plus highlights key concerns in their verification.
What can connected cars learn from starlings and sardines? NXP’s René Jansen says the collective actions of swarms in the natural world could hold keys to better-flowing traffic.
If you missed last week’s System-Level Design newsletter, check out the featured blogs:
Editor in Chief Ed Sperling contends the semiconductor industry needs less rigid walls and a new roadmap.
Technology Editor Brian Bailey looks back at the hottest topics for engineers this year.
Senior Editor Jesse Allen provides an update on Semiconductor Engineering’s Knowledge Center, along with some pop quizzes.
Synopsys’ Tom De Schutter looks at the importance of software and end-to-end prototyping.
Aldec’s Louie De Luna digs into the DO-254 planning process and what can go wrong.
Cadence’s Frank Schirrmeister observes that the focus of verification teams should be to focus on the job, not how to implement the execution.
Mentor Graphics’ John Parry shows how to calculate savings using transient thermal testing, in A Better Way To Measure Heat.