Colonization costs; interacting with IoT; FPGAs in early software development; trying other options; Type C appears; IoT growth; trusting thermal analysis; Lam’s history.
NASA estimates they could reduce the cost of colonizing the moon to $10 billion, with mining fuel from the lunar surface potentially making the satellite a gas station on the way to Mars or beyond. This week’s top five articles from Ansys’ Bill Vandermark are mostly out of this world, but there’s a down-to-earth aspect as airless tires roll closer to inclusion in consumer vehicles.
How will consumers interact with their IoT devices and applications in a world where everything is connected? Rambus’ Aharon Etengoff provides a peek at the future of ubiquitous connectivity during a keynote discussion at the IoT Influencers Summit.
How are you dealing with increasing chip design complexity? Cadence’s Christine Young covers a talk by Hobson Bullman of ARM, who questions the role of FPGAs in early software development.
While a tried and tested approach may be best, you cannot be sure until you have considered other options, says Mentor’s Colin Walls. When it comes to embedded programming, is C the only way?
USB Type C is arriving, and Synopsys’ Eric Huang provides an overview of what to look forward to as system makers roll out the new USB 3.1 connector.
IoT hopefuls seeking the most lucrative opportunities should look to the enterprise sector, according to IDC Fellow Vernon Turner. ARM’s Brian Fuller takes a look at IoT’s projected growth.
NXP’s Christopher Hill looks at the ‘what ifs’ of thermal analysis, and if one can trust the simulations to give reasonably accurate answers to thermal consequences.
In an anniversary celebration, a Lam Research staff writer provides a timeline of defining events during the company’s 35 years.
For more good reading, check out the blogs featured in last week’s Manufacturing, Design & Test newsletter:
Editor In Chief Ed Sperling questions why the number of options is increasing while the semiconductor industry is undergoing consolidation.
Executive Editor Mark LaPedus points to biotech, power semis and selective deposition as key technologies for the future.
Mentor Graphics’ Jeff Wilson observes that fill techniques are evolving with each new process node and a shift-left approach to EDA.
Semico Research’s Joanne Itow finds inflections, new companies and materials, and new uses for technology, along with some interesting shifts at SEMICON West.
Techcet’s Michael Fury points to an upward trend for ALD/CVD precursors, CMP consumables, electronic gases, silicon wafers and sputtering targets.