Automotive Tier 1.5?; HLS for fun; disclosing vulnerabilities; changing power devices; cyber threat, physical system.
Mentor’s Andrew Macleod proposes that the growing complexity of automotive systems opens up room for a Tier 1.5 bridging systems engineering and design optimization.
Cadence’s Dave Pursley argues that working at a higher level of abstraction makes hardware design more effective, more interesting, and more fun.
Synopsys’ Robert Vamosi considers the challenges surrounding responsible disclosure of vulnerabilities.
Applied’s Ben Lee digs into how the automotive market is driving the evolution of power ICs.
Rambus’ Asaf Ashkenazi looks at the growing threat cyberattacks pose to physical systems as unprotected IoT endpoints proliferate.
Ansys’ Robert Harwood says disruptive technologies are blurring the boundaries of previously well-defined industries.
ARM’s Freddi Jeffries listens in on the upcoming challenges for VR, at the Game Developer’s Conference.
From MWC, Cadence’s Paul McLellan shares several companies’ takes on the state of the mobile industry.
Mentor’s Steve Pateras observes that ensuring safety and reliability requires a full life-cycle approach to automotive test.
Editor In Chief Ed Sperling argues that it’s time the tech industry begins embracing security solutions as the number of threats continues to expand.
Executive Editor Ann Steffora Mutschler digs into automotive safety requirements and finds the path to get there is still fuzzy.
Rambus’ Asaf Ashkenazi finds it’s not just businesses anymore that can be held hostage—it’s also smart cars and homes.
Mentor Graphics’ Jeff Miller predicts the proliferation of low-cost sensors will provide opportunities for an array of innovative products.
Editor In Chief Ed Sperling argues that the current approach of hiring white-hat hackers to prevent breaches isn’t good enough.
Technology Editor Jeff Dorsch traces the origin of automatic test equipment to Teradyne in 1960.
Mentor Graphics’ Tarek Ramadan contends that EDA companies, OSATs and foundries need to collaborate to ensure wafer-level packaging yield and performance.