Blog Review: Oct. 19

Reusable code; 2.5D and characterization; USB heat; power ICs in China.

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Mentor’s Colin Walls provides some tips on writing portable, reusable code.

Cadence’s Christine Young contends that you should never use 2.5D for characterization at advanced nodes.

Synopsys’ Eric Huang considers one impractical use of USB heating and the IoT.

Applied’s Ben Lee predicts a rapid growth in China’s power device manufacturing.

NXP’s Joppe Bos digs into the challenges of building a secure cryptographic software solution.

From a new dwarf planet to colonizing Mars, Ansys’ Tom Smithyman shares some tales of space with his top five tech picks for the week.

Rambus’ Aharon Etengoff checks out the trends in mobile payments and what providers will have to do to encourage adoption.

If you’re attending ARM TechCon, ARM’s Brian Fuller has a few things to be sure not to miss.

Cadence’s Paul McLellan checks out the perils of incoherency and what’s new in the land of cache coherent interconnects.

Plus, check out the blogs featured in last week’s Low Power-High Performance newsletter:

Editor In Chief Ed Sperling finds that as new compute and chip architectures roll out some classic tradeoffs are changing.

Ansys’ Youngsoo Lee digs into why the ‘throw-it-over-the-wall’ approach no longer works and what needs to take its place.

Cadence’s Steve Carlson observes that more complex power management techniques are impacting system performance in ways that are complicated to predict.

ARM’s James Scobie examines how to reduce the complexity of managing safety-critical code.

Rambus’ Steven Woo argues that exploring new system architectures will be necessary for the IoT.

Synopsys’ Angela Raucher points out why processor selection and configuration are so critical.

Mentor Graphics’ Rizwann Farooq look at a new approach to in-circuit emulation.