Business & Marketing Strategies

The Week In Review: Manufacturing

DRAM shortages; fabless rankings; rad-hard SRAMs; AMAT results.

The Week in Review: IoT

Dateline: Dresden; Emerson woos Rockwell; Gemalto, HiSilicon team.

The Week In Review: Design

HW/SW co-simulation for FPGA; bus planning; HPC compilers; high-bandwidth networking.

Automotive Foundries

As traditional market boundaries fall, Tier 1s will square off against commercial chip foundries. Who will win?

Five Trends In IC Packaging

A reporter’s takeaways from recent packaging events.

blog (more)

The Week in Review: IoT

IoT market growth; investments in IoT; Cambium products.

Generically Reusable IP No One Uses

If we just keep putting generically reusable on the box, all we’re doing is...

Blogs - LPHP (more)

Getting Power Management Right

There are many technical avenues to managing the power in heterogenous SoCs t...

Quantum Madness

Multiple companies focus on qubits as next computing wave, but problems remai...

An Incremental Approach To Reusing Automated Tests From IPs To SoCs

Getting started with portable stimulus at the block, subsystem, and system le...

Blogs - MD (more)

Automotive Foundries

As traditional market boundaries fall, Tier 1s will square off against commer...

Five Trends In IC Packaging

A reporter’s takeaways from recent packaging events.

What’s What In Advanced Packaging

A look at different packaging options and technologies.

Blogs - PTES (more)

What’s Missing In Packaging

As heterogeneous combinations of chips are used for new applications, will th...

2017 ITC Wrap-up

News from Advantest, Optimal+, Astronics Test Systems.

Let’s Be Smart About Artificial Intelligence

When considering applications of AI, it's important to take the human respons...

Blogs - Security (more)

What Are You Going To Do About IoT Security?

Everyone agrees there's a big problem. So now what?

Effective Management Of System Designs

Why information gets lost and how you can prevent that from happening while a...

The Case For Combining CPUs With FPGA Fabrics

How to continue driving performance gains as the benefits of scaling fall off.

Blogs - SLD (more)

Introducing The 55th DAC General Chair

A top-level view of this year's conference topics.

Technology For The Privileged

Will technology improve life for everyone or just a privileged few? Understan...

ADAS Design Shifts Toward Hardware

Move could guide autonomous driving's future.

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Foundry Forum (more)

Samsung Foundry’s Business Strategy

A look at manufacturing changes and advanced technology updates.

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

ImPatterning (more)

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to cr...

ReRAM Gains Even More Steam

Latest manufacturing techniques are being explored as commercial products beg...

Molecular Imprints becomes a virtual reality company

Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

The Week in Review: IoT

Dateline: Dresden; Emerson woos Rockwell; Gemalto, HiSilicon team.

The Week in Review: IoT

Mocana mix; merger fever; LTE traffic.

What Are You Going To Do About IoT Security?

Everyone agrees there's a big problem. So now what?

Knowledge Central (more)

Major Growth For Knowledge Center

An update on the Knowledge Center, plus a few pop quizzes.

Industry Collaboration Starts

Check out all the new stuff...And this is just the beginning.

Welcome To The Knowledge Center

There are more than 1,600 information pages already in the system, and many m...

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

The Return Of Body Biasing

This technique lets engineering teams reach new power lows, but it's not alwa...

Getting Power Management Right

There are many technical avenues to managing the power in heterogenous SoCs t...

Power/Performance Bits: Nov. 14

Bacteria power wastewater cleanup; perovskites for terahertz communications; ...

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing and Design (more)

The Week In Review: Manufacturing

DRAM shortages; fabless rankings; rad-hard SRAMs; AMAT results.

Automotive Foundries

As traditional market boundaries fall, Tier 1s will square off against commer...

Five Trends In IC Packaging

A reporter’s takeaways from recent packaging events.

News (more)

The Week In Review: Manufacturing

DRAM shortages; fabless rankings; rad-hard SRAMs; AMAT results.

The Week in Review: IoT

Dateline: Dresden; Emerson woos Rockwell; Gemalto, HiSilicon team.

The Week In Review: Design

HW/SW co-simulation for FPGA; bus planning; HPC compilers; high-bandwidth net...

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Packaging and Test (more)

What’s Missing In Packaging

As heterogeneous combinations of chips are used for new applications, will th...

2017 ITC Wrap-up

News from Advantest, Optimal+, Astronics Test Systems.

Don’t Let FPGA Compiles Be a Bottleneck

How to create real-time, over-the-air testbeds.

Power Architect (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Green Computing: GPUs Strike Back

Speed matters, but so does efficiency.

Making Waves In Deep Learning

How deep learning applications will map onto a chip.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: Nov. 14

GaN for electric cars; GaN gas sensors; bulk GaN templates.

System Bits: Nov. 14

Cyber attack tracking; entangled atoms; next-gen search.

Power/Performance Bits: Nov. 14

Bacteria power wastewater cleanup; perovskites for terahertz communications; ...

Round Tables (more)

Which Verification Engine?

Experts at the Table, part 1: No single tool does everything, but do all veri...

How To Build An IoT Chip

Experts at the Table, part 2: Where data gets processed, how to secure device...

Power Modeling And Analysis

Experts at the Table, part 3: Juggling accuracy and fidelity while making the...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

What’s Next For Atomic Layer Etch?

Technology begins shipping, but which approaches work best, and where, is sti...

China’s Ambitious Automotive Plans

After years of playing catch-up to multinationals, the country is targeting a...

Trimming Waste In Chips

How much extra circuitry is necessary is a matter of debate, but almost every...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

Performance-IP: Less Memory Latency

Embedded IP improves performance by identifying and isolating random requests.

Fractilia: Pattern Roughness Metrology

Litho expert Chris Mack has started a new company that addresses line-edge ro...

Sigasi: Cleaner VHDL And SystemVerilog

Company applies software techniques to hardware coding.

System-Level Design (more)

The Week In Review: Design

HW/SW co-simulation for FPGA; bus planning; HPC compilers; high-bandwidth net...

Blog Review: Nov. 15

Using formal; thermo-mechanical PCB modeling; IoT in manufacturing; exascale ...

System Bits: Nov. 14

Cyber attack tracking; entangled atoms; next-gen search.

Technical Papers (more)

Making high-capacity data caches more efficient

Cache-management scheme that they say improves the data rate of in-package DRAM

How Neural Networks Think (MIT)

General-purpose technique sheds light on inner workings of neural nets traine...

New AI algorithm monitors sleep with radio waves (MIT & Mass General)

Learning Sleep Stages from Radio Signals

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Variation Spreads At 10/7nm

Differences in equipment under scrutiny as tolerances tighten.

Overlay Challenges On The Rise

Move to 10/7nm and beyond creates need for more precise metrology and alignme...

The Return Of Body Biasing

This technique lets engineering teams reach new power lows, but it's not alwa...

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

Making high-capacity data caches more efficient

Cache-management scheme that they say improves the data rate of in-package DRAM

How Neural Networks Think (MIT)

General-purpose technique sheds light on inner workings of neural nets traine...

ARM Moves Further Into Automotive With NXP’s Launch of S32K Series To The General Market

How NXP is using a scalable approach combined with a common package strategy ...

Videos (more)

Tech Talk: Near-Threshold Power

A look at the power benefits and performance impact as designs move closer to...

Tech Talk: eFPGA LUTs

Which look-up tables to use for different applications.

Tech Talk: eFPGA Programming

How working with embedded FPGAs differs from ASICs.

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

Challenges And Trends In SoC Electromagnetic (EM) Crosstalk

How to avoid significant delays in time-to-market and cost over-runs.

Making The Case For Digital Exploration

Why faster simulation is essential to meet the demands for more customized an...

Automating Tests With Portable Stimulus From IP To SoC Level

A look at what PS is intended to do, and what it's not intended to do.


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