Business & Marketing Strategies

Manufacturing Bits: Nov. 13

Quantum memories; neuron circuits; MRAM deal.

System Bits: Nov. 13

DL allergen detection; folded optical devices; skin-like sensor.

Power/Performance Bits: Nov. 13

ML identifies LED material; protecting batteries with nanotubes; saving energy on cooling.

Establishing the Root of Trust for the Internet of Things

Securing the IoT will require a holistic approach.

AI Accelerator Gyrfalcon Soars Post Stealth

Second generation inference accelerator ASIC targets the datacenter.

All About Test (more)

What’s in a Name?

Test Vision 2020 may need a new moniker.

NIWeek Test Talk

National Instruments executives discuss semiconductor testing.

The Best in Test

VLSI Research recognizes leading test vendors.

blog (more)

Looking For The Elephant In The Valley

Female role models doing exceptional things in tech have always existed. Hope...

The Week in Review: IoT

IoT market growth; investments in IoT; Cambium products.

Generically Reusable IP No One Uses

If we just keep putting generically reusable on the box, all we’re doing is...

Blogs - LPHP (more)

Die-to-Die Interconnects for Chip Disaggregation

How to speed up communication between dies in a package.

Die-To-Die Interconnects For Chip Disaggregation

The key to successfully taking a multi-die approach to designs.

Accelerators Everywhere. Now What?

An explosion in data will require a massive amount of hardware and software e...

Blogs - MD (more)

3D NAND: Challenges Beyond 96-Layer Memory Arrays

Bottlenecks in stacking memory layers and new opportunities for solutions.

EUV’s Uncertain Future

Litho tech has finally arrived after years of delays and billions of dollars ...

Silicon Wafers: Tight Supply, High Prices

How long will the shortages last?

Blogs - PTES (more)

The Next Materials Race

Why a trade war isn't all bad for the semiconductor materials market.

Love and Affection in the Age of Robots

What happens when people begin interacting with machines?

Virtual Packages Improve Signal Integrity

How to optimize chiplet architectures, including reducing in-package loss and...

Blogs - Security (more)

Establishing the Root of Trust for the Internet of Things

Securing the IoT will require a holistic approach.

Research: The Heart and Soul of DAC

Focus is expanding from just chips to include emerging challenges that span e...

It’s Time For Companies To Embrace IP Management

What keeps companies from adopting new methods that could improve efficiency?

Blogs - SLD (more)

The Race To Design Larger Systems

The semiconductor industry finally is getting the chance to prove itself on a...

Reduction In First Silicon Success

Verification costs are contained, but at what cost to success rates? Mentor's...

Make-Or-Break Time For Portable Stimulus

We hear a lot from vendors about the new Portable Stimulus Standard, but how ...

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

EDA For Manufacturability (more)

Crossing The Chasm: Uniting SoC And Package Verification

EDA companies, OSATs, and foundries must collaborate to ensure wafer-level pa...

Will EUV Kill Multi-Patterning?

Even with EUV in play, i193 multi-patterning may still be the most cost effec...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Foundry Forum (more)

Samsung Foundry’s Business Strategy

A look at manufacturing changes and advanced technology updates.

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

ImPatterning (more)

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to cr...

ReRAM Gains Even More Steam

Latest manufacturing techniques are being explored as commercial products beg...

Molecular Imprints becomes a virtual reality company

Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.

Inside Big Data (more)

Is It Safe To Assume That All “Passed” Die Are Actually “Good” Die?

Detecting tricky test escapes and preventing defective parts from getting int...

Are All Known Good Tested Devices Created Equal?

Post-mortem on RMAs backed by Big Data Analytics prove otherwise.

A More Efficient Way To Calculate Device Specs Of Thousands Of Tests For Improved Quality And Yield

Using actual device performance data is a critical safeguard to ensure qualit...

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

Establishing the Root of Trust for the Internet of Things

Securing the IoT will require a holistic approach.

Research: The Heart and Soul of DAC

Focus is expanding from just chips to include emerging challenges that span e...

It’s Time For Companies To Embrace IP Management

What keeps companies from adopting new methods that could improve efficiency?

Knowledge Central (more)

Major Growth For Knowledge Center

An update on the Knowledge Center, plus a few pop quizzes.

Industry Collaboration Starts

Check out all the new stuff...And this is just the beginning.

Welcome To The Knowledge Center

There are more than 1,600 information pages already in the system, and many m...

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Power/Performance Bits: Nov. 13

ML identifies LED material; protecting batteries with nanotubes; saving energ...

Why Chips Die

Semiconductor devices face many hazards before and after manufacturing that c...

Die-to-Die Interconnects for Chip Disaggregation

How to speed up communication between dies in a package.

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing and Design (more)

Manufacturing Bits: Nov. 13

Quantum memories; neuron circuits; MRAM deal.

Week In Review: Manufacturing, Test

Trade issues; testing STT-MRAM; silicon wafer shipments.

Manufacturing Bits: Nov. 6

FISH metrology; locating atoms with AI; machine vision.

News (more)

Week In Review: Manufacturing, Test

Trade issues; testing STT-MRAM; silicon wafer shipments.

Week in Review: IoT, Security, Auto

Private 5G; cybersecurity M&A; Tencent jobs.

Week In Review: Design, Low Power

SMIT acquires S2C; RTL-to-GDSII, mixed-signal, synthesis tools; RISC-V simula...

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Packaging and Test (more)

The Next Materials Race

Why a trade war isn't all bad for the semiconductor materials market.

5 Best Practices For Successfully Managing An ASIC Supply Chain

How to reduce cost, improve yield, and maintain better control.

Panel Fan-out Ramps, Challenges Remain

Cost and the lack of a panel-size standard gives fan-out a slower start.

Power Architect (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Green Computing: GPUs Strike Back

Speed matters, but so does efficiency.

Making Waves In Deep Learning

How deep learning applications will map onto a chip.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: Nov. 13

Quantum memories; neuron circuits; MRAM deal.

System Bits: Nov. 13

DL allergen detection; folded optical devices; skin-like sensor.

Power/Performance Bits: Nov. 13

ML identifies LED material; protecting batteries with nanotubes; saving energ...

Round Tables (more)

The Impact of Domain Crossing on Safety

Experts at the Table, part 3: What addition problems does this create in appl...

Machine Learning Invades IC Production

Experts at the Table, part 1: Will machine learning and AI improve chip manuf...

So Many Waivers Hiding Issues

Experts at the Table, part 2: Domain crossings can produce thousands of waive...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

Why Chips Die

Semiconductor devices face many hazards before and after manufacturing that c...

Carmakers To Chipmakers: Where’s The Data?

Different perspectives and needs create friction as more advanced electronics...

A Crisis In DoD’s Trusted Foundry Program?

GlobalFoundries' decision to put 7nm on hold is raising concerns across the m...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

AI Accelerator Gyrfalcon Soars Post Stealth

Second generation inference accelerator ASIC targets the datacenter.

Zeno Semi Expands On-Chip Memory

Shrinking SRAM expands on-chip memory with standard CMOS, FinFET.

Startup Puts Quantum Security on USB, Dongles

Taking quantum-mechanical principles and dragging them kicking and screaming ...

System-Level Design (more)

System Bits: Nov. 13

DL allergen detection; folded optical devices; skin-like sensor.

Week In Review: Design, Low Power

SMIT acquires S2C; RTL-to-GDSII, mixed-signal, synthesis tools; RISC-V simula...

Blog Review: Nov. 7

HDMI scrambling; the trolley problem; monitoring PDNs.

Technical Papers (more)

Machine Learning Based Prediction: Health Behavior on BP

ML algorithm + individual data = personalized recommendations to reduce blood...

Autonomous Vehicle Navigation in Rural Environments without Detailed Prior Maps (MIT)

Self-driving technology for back roads

Silicon CMOS Architecture For A Spin-based Quantum Computer

UNSW researchers have shown how a quantum computer can be manufactured using ...

The Connected Perspective (more)

2017: A Good Year for ATE

Test equipment sales were up, and so were the share prices of ATE stocks.

That Was The Year That Was In Test

2017 featured a big proposed acquisition.

2017 ITC Wrap-up

News from Advantest, Optimal+, Astronics Test Systems.

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Design For Advanced Packaging

Stacking die is garnering more attention, but design flows aren’t fully rea...

Taming NBTI To Improve Device Reliability

Negative-bias temperature instability can cause an array of problems at advan...

Computing Way Outside Of A Box

Arm's CTO talks about how AI and the end of Moore's Law are shaking up proces...

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

designHUB: Design Reuse Made Real

Why companies need to reassess legacy processes, tools and design management ...

Cure The Common Cold…

...And much more. A call for papers for Arm TechCon.

The Week in Review: IoT

Orangeworm; medical insecurity; SamSam ransomware.

Videos (more)

ATE Lab To Fab

How to close the gap between the design and test worlds to improve coverage a...

Using DSA With EUV

Why directed self-assembly still has an important role to play at the most ad...

AI Training Chips

How to speed up algorithms and improve performance.

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

How to Design, Optimize and Validate Safe Laser Headlamps Through Virtual Experimentation

How simulating road conditions can help automakers design safer headlamps.

Hack the Vote: The Simulation of Vote Hacking at DEF CON

Hacktivists' demos warn that elections are hackable.

Fusion Compiler: Comprehensive RTL-to-GDSII Implementation System

How the Fusion Compiler handles advanced process nodes and delivers up to 20%...


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RISC-V: More Than a Core

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