Business & Marketing Strategies

The Week In Review: Manufacturing

Toshiba to exit ICs?; IC rankings; Samsung-Audi; micro-amusement parks.

The Week In Review: IoT

Intel goes shopping; OCF at CES; IoT market reports.

The Week In Review: Design

ATopTech files for bankruptcy, moves to sell; MIPI Discovery for driver development; new GPU IP from Imagination; safety-critical FPGA verification...

Putting The Brakes On Consolidation

Oversight by government agencies is rising, putting a damper on future deals—particularly those involving China.

5 Takeaways From ISS

Bullish forecasts, China and EUV took center stage at the event.

Assembly and Packaging (more)

Inside Advanced Patterning

What's in store for chipmakers at 7nm, 5nm and beyond, and why atomic-level e...

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design

Part 2: Why measurement is required to validate assumptions prior to fabricat...

Multi-Patterning Issues At 7nm, 5nm

Variations in different masks, alignment problems and the physical limits of ...

Blogs - APT (more)

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design

Part 2: Why measurement is required to validate assumptions prior to fabricat...

Blogs - LPHP (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Border Tax Shakeup

How bureaucracy can mess up the semiconductor supply chain.

What’s Missing In Deep Learning?

Neural networking is the rising star in the world of computer science. How do...

Blogs - MD (more)

Putting The Brakes On Consolidation

Oversight by government agencies is rising, putting a damper on future dealsâ...

5 Takeaways From ISS

Bullish forecasts, China and EUV took center stage at the event.

Will EUV Kill Multi-Patterning?

Even with EUV in play, i193 multi-patterning may still be the most cost effec...

Blogs - Security (more)

Era Of 3D Printing Begins

What used to be a tool for prototyping is becoming much more than that. Now w...

In-Vehicle Networks Are Safety, Security Dependent

The more that is integrated into the automobile, the more risks emerge.

Looking Back On IoT In 2016

It was a year of great interest in the IoT, for good reasons and bad.

Blogs - SLD (more)

Happy 25th Birthday, HAL!

AI has come a long way since HAL became operational.

So Much For Pure Science

Mathematics has confused everyone since the dawn of civilization.

Crazy Christmas Patents

There is no end to the things that people think are worth patenting, especial...

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

The Week In Review: IoT

Intel goes shopping; OCF at CES; IoT market reports.

What Can Go Wrong In Automotive

Experts at the Table, part 2: Understanding security risks, ECUs vs. SoCs; de...

The Week In Review: IoT

NI sets up IIoT Lab; FarmLogs adds $22M in funding; IoT news from CES.

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Performance Increasingly Tied To I/O

Chipmakers look beyond processor speeds as rate of performance improvements s...

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Power/Performance Bits: Jan. 17

Creating magnets with electricity; bad news for perovskite solar; unraveling ...

Manufacturing and Design (more)

The Week In Review: Manufacturing

Toshiba to exit ICs?; IC rankings; Samsung-Audi; micro-amusement parks.

Putting The Brakes On Consolidation

Oversight by government agencies is rising, putting a damper on future dealsâ...

5 Takeaways From ISS

Bullish forecasts, China and EUV took center stage at the event.

News (more)

The Week In Review: Manufacturing

Toshiba to exit ICs?; IC rankings; Samsung-Audi; micro-amusement parks.

The Week In Review: IoT

Intel goes shopping; OCF at CES; IoT market reports.

The Week In Review: Design

ATopTech files for bankruptcy, moves to sell; MIPI Discovery for driver devel...

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: Jan. 17

GOOI FETs; gallium oxide epi; EU patterning program.

System Bits: Jan. 17

Overcoming quantum hurdles; illness-sensing biosensors.

Power/Performance Bits: Jan. 17

Creating magnets with electricity; bad news for perovskite solar; unraveling ...

Round Tables (more)

What Can Go Wrong In Automotive

Experts at the Table, part 2: Understanding security risks, ECUs vs. SoCs; de...

IoT Security Risks Grow

Experts at the table, part 2: Mirai, Shodan, and where the holes are in secur...

BEOL Issues At 10nm And 7nm

Experts at the table, part 2: The impact and cost of air gap; reducing RC del...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

China Unveils Memory Plans

Government and industry are investing tens of billions of dollars, but so far...

Performance Increasingly Tied To I/O

Chipmakers look beyond processor speeds as rate of performance improvements s...

The Multiplier And The Singularity

AI makes interesting reading, but physics will limit just how far it can go a...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

SiFive: Low-Cost Custom Silicon

Company seeks to build solutions based on open-source processor cores.

GMK: Rethinking The Audio Jack

Korean startup adds power and digital communication to standard headphone plu...

MapD Makes GPUs First-Class Citizens

A San Francisco-based startup has come up with a novel solution for solving t...

System-Level Design (more)

The Week In Review: Design

ATopTech files for bankruptcy, moves to sell; MIPI Discovery for driver devel...

Blog Review: Jan. 18

Skipping nodes; MIPI I3C; security and RISC-V; contact resistance; packaging;...

System Bits: Jan. 17

Overcoming quantum hurdles; illness-sensing biosensors.

Technical Papers (more)

Coherence Times Of Bose-Einstein Condensates Beyond The Shot-Noise Limit Via Superfluid Shielding

MIT extends the coherence time of separated Bose-Einstein condensates that in...

FDA: Postmarket Management of Cybersecurity in Medical Devices

FDA issues guidance to inform industry and FDA staff of recommendations for m...

Strategic Principles For Securing The Internet Of Things (IoT)

Risks, non-binding principles and suggested best practices for a responsible ...

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Foundry Files (more)

MEMS Explosion

The latest milestones and future trends for making MEMS a mainstream technology.

What’s In A Name?

Designing real value into new technology nodes.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Transferring Skills Getting Harder

Error rates rising because design complexity now requires persistent expertis...

Inside Photomask Writing

What technologies will be used at 5nm and why.

What Can Go Wrong In Automotive

Experts at the Table, part 2: Understanding security risks, ECUs vs. SoCs; de...

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

More Than Just Carbon Dioxide

Part 4: The quest to limit greenhouse gases.

The Week In Review: IoT

DARPA boosts IoT security; Dell expands IoT program; IoT market to hit $3B in...

Seeing The Future Of Vision

Self-driving cars and other uses call for more sophisticated vision systems.

Videos (more)

Tech Talk: Extending DRAM

A deep dive into working with vertical memory.

Tech Talk: Timing Closure

Why timing closure is suddenly a problem again and what to do about it.

Tech Talk: FD-SOI vs. FinFET

Cost, performance, multi-patterning and the 12nm roadmap.

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

Accuracy In Optical Overlay Metrology

The physics by which process variations determine accuracy and robustness of ...

Standardizing Platforms From Characterization To Production

Why just doing things the old way adds cost and inefficiency.

FinFET And Multi-Patterning Aware Place-And-Route Implementation

How to deal with new challenges in floor planning and physical verification.


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