Business & Marketing Strategies

Semiconductor Process Development: Finding A Faster Way To Profitability

Why virtual fabrication is so valuable in process modeling.

Semiconductor CapEx To Increase 4.3% In 2017

Sales growth up slightly from 2016; Intel, SK Hynix, Toshiba and Western Digital lead the pack.

Get Ready For Nanotube RAM

This nonvolatile technology is as fast as DRAM, uses same tools and processes as other memory.

The Week In Review: Manufacturing

Toshiba’s woes; GF’s parent; Applied’s results; R&D leaders.

The Week In Review: IoT

Optimal+ joins the IIC; NXP debuts secure platform; Cadence goes to MWC.

Blogs - LPHP (more)

Fix Processes, Then Silos

Adapting engineering organizations to deal with power and security is as comp...

Adapting Formal

Formal technology has long been accepted as a powerful verification tool. It'...

Confidence In 7nm Designs Requires Multi-Variable, Multi-Scenario Analysis

Getting the design right the first time has higher stakes than ever before.

Blogs - MD (more)

Semiconductor Process Development: Finding A Faster Way To Profitability

Why virtual fabrication is so valuable in process modeling.

Semiconductor CapEx To Increase 4.3% In 2017

Sales growth up slightly from 2016; Intel, SK Hynix, Toshiba and Western Digi...

The Return Of Time Sharing

An explosion of data has changed how technology is used and prioritized.

Blogs - PTES (more)

Addressing Test Time Challenges

Improving test strategies is key to cutting costs.

More Degrees Of Freedom

Adding a Z axis is just the beginning.

ATO 2017: Driven by Necessity

Technology Convergence in the Automotive Industry

Blogs - Security (more)

IoT Security Ratings Needed

Companies are now focused on security, but so far there is no simple way to s...

Work Remains To Enable Connected Cars, Automotive Security

There is progress with connected cars, and automotive security, but we’re n...

Fixing Security Holes

Why chipmakers need to pay attention to side-channel attacks.

Blogs - SLD (more)

Rush Hour On The Technology Roadmap

Dramatic shifts in the semiconductor industry are evident in this year's ISSC...

Bidding War On H-1B Visas?

Any restrictions on expertise will have far-reaching effects in the semicondu...

Ethics And The Singularity

Understanding prejudices is critical to building intelligent systems.

Blogs – APT (more)

Packaging Wars Ahead

The push into 2.5D and fan-outs will launch a new round of fireworks in the s...

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

The Week In Review: IoT

Optimal+ joins the IIC; NXP debuts secure platform; Cadence goes to MWC.

The Week In Review: IoT

Gartner forecast; Android Wear 2.0; IoT World.

The Week In Review: IoT

NXP financials; blockchain security for IoT; Joule adds Android Things.

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Test More Complex For Cars, IoT

Safety-critical markets add new challenges for testing methodology, which can...

Power/Performance Bits: Feb. 14

Electronics for Venus; low-power voice recognition; cheaper, safer flow batte...

New Memories And Architectures Ahead

So far there is not widespread adoption, but many see change as inevitable.

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing and Design (more)

Semiconductor Process Development: Finding A Faster Way To Profitability

Why virtual fabrication is so valuable in process modeling.

Semiconductor CapEx To Increase 4.3% In 2017

Sales growth up slightly from 2016; Intel, SK Hynix, Toshiba and Western Digi...

Get Ready For Nanotube RAM

This nonvolatile technology is as fast as DRAM, uses same tools and processes...

News (more)

The Week In Review: Manufacturing

Toshiba’s woes; GF’s parent; Applied’s results; R&D leaders.

The Week In Review: IoT

Optimal+ joins the IIC; NXP debuts secure platform; Cadence goes to MWC.

The Week In Review: Design

Mentor's new emulator; mixed-language DRC & CDC verification; FPGAs and eFPGA...

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Packaging and Test (more)

OSAT Biz: Growth And Challenges

Dizzying number of options emerge, but cost remains key factor.

Addressing Test Time Challenges

Improving test strategies is key to cutting costs.

More Degrees Of Freedom

Adding a Z axis is just the beginning.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: Feb. 14

Making quark soup; developing stable helium.

System Bits: Feb. 14

Drug-selecting neural network; industrial ransomware; smartphone neutrino app.

Power/Performance Bits: Feb. 14

Electronics for Venus; low-power voice recognition; cheaper, safer flow batte...

Round Tables (more)

BEOL Issues At 10nm And 7nm

Experts at the table, part 3: EUV, metallization, self-alignment, ALD, and th...

New Embedded Memories Ahead

Options grow as new wave of MCUs demand more capable NVM.

What Can Go Wrong In Automotive

Experts at the Table, part 3: Why power has become so important in car electr...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

Battling Fab Cycle Times

Why it's taking longer to manufacture chips at 10/7nm and what can be done ab...

Devices Threatened By Analog Content?

With few measurable methods to assess analog quality, it's not clear how that...

Betting On Wafer-Level Fan-Outs

Chipmakers focus on packaging to reduce routing issues at 10nm, 7nm. Tool and...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

Sigasi: Cleaner VHDL And SystemVerilog

Company applies software techniques to hardware coding.

SiFive: Low-Cost Custom Silicon

Company seeks to build solutions based on open-source processor cores.

GMK: Rethinking The Audio Jack

Korean startup adds power and digital communication to standard headphone plu...

System-Level Design (more)

The Week In Review: Design

Mentor's new emulator; mixed-language DRC & CDC verification; FPGAs and eFPGA...

Blog Review: Feb. 15

Emulation growth; hardware designer's role; software vulnerabilities; OpenFog...

System Bits: Feb. 14

Drug-selecting neural network; industrial ransomware; smartphone neutrino app.

Technical Papers (more)

Wearable AI System Can Detect A Conversation Tone (MIT)

An artificially intelligent, wearable system that can predict if a conversati...

Microbiologists Make Big Leap in Developing ‘Green’ Electronics

UMass Amherst research finds microbe from the Potomac yields better electroni...

Coherence Times Of Bose-Einstein Condensates Beyond The Shot-Noise Limit Via Superfluid Shielding

Cornell extends the coherence time of separated Bose-Einstein condensates tha...

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Foundry Files (more)

MEMS Explosion

The latest milestones and future trends for making MEMS a mainstream technology.

What’s In A Name?

Designing real value into new technology nodes.

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Get Ready For Nanotube RAM

This nonvolatile technology is as fast as DRAM, uses same tools and processes...

Progress In Flexible Electronics

Hybrid approach pairs very thin silicon with printed interconnects and sensors.

What Are FeFETs?

How this new memory stacks up against existing non-volatile memory.

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

Wearable AI System Can Detect A Conversation Tone (MIT)

An artificially intelligent, wearable system that can predict if a conversati...

More Than Just Carbon Dioxide

Part 4: The quest to limit greenhouse gases.

The Week In Review: IoT

DARPA boosts IoT security; Dell expands IoT program; IoT market to hit $3B in...

Videos (more)

Tech Talk: Extending DRAM

A deep dive into working with vertical memory.

Tech Talk: Timing Closure

Why timing closure is suddenly a problem again and what to do about it.

Tech Talk: FD-SOI vs. FinFET

Cost, performance, multi-patterning and the 12nm roadmap.

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

Electrothermal Mechanical Stress Reference Design Flow For Printed Circuit Boards And Electronic Packages

A methodology for solving multi-physics issues in IC packages, touch displays...

How Formal Reduces Fault Analysis For ISO 26262

Conclusive methods for reducing failure rates in safety-critical systems.

Connected Car Driving Change In Defect Detection

How to improve security at the device level for automobiles.


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