Business & Marketing Strategies

Computer Vision Sees a Bright Future

Using high-level synthesis to address changing algorithms, specifications and requirements.

AI’s Growing Impact On Chip Design

Synopsys' chairman looks at what really got the AI explosion rolling and what it means for hardware and software.

Developing Smarter, Safer Cars with ADAS IP

Optimize performance, safety, and reliability in ADAS applications via a holistic design approach.

Hardware Mathematics for Artificial Intelligence

Why math and a library of mathematical IP cores is important for AI.

Machine Learning For IC Production

Experts at the Table, part 3: Where can this technology be applied and what’s ahead.

All About Test (more)

What’s in a Name?

Test Vision 2020 may need a new moniker.

NIWeek Test Talk

National Instruments executives discuss semiconductor testing.

The Best in Test

VLSI Research recognizes leading test vendors.

blog (more)

Looking For The Elephant In The Valley

Female role models doing exceptional things in tech have always existed. Hope...

The Week in Review: IoT

IoT market growth; investments in IoT; Cambium products.

Generically Reusable IP No One Uses

If we just keep putting generically reusable on the box, all we’re doing is...

Blogs - LPHP (more)

How to Make Sure IP will Float in the Rough SoC Sea

The impact of coupling on designs and what to watch out for.

How to nail functional safety in your next design

Lock step, redundant execution and split-lock—which is better and why.

Security, Scaling and Power

Why these three things are related and what it means for Intel and the rest o...

Blogs - MD (more)

Will AI Drive Scaling Forward?

There may be a new application that demands more density and processing power.

5 Observations From Intel’s Event

Mysterious locations, codenames and process delays are on the top of the list.

What’s Changing In Memory

Innovations in materials and systems will be required for the next generation...

Blogs - PTES (more)

Testing AI Systems

What exactly are we trying to accomplish? So far, that's not clear.

What AI Is… And Isn’t

To make the best use of AI, understand its limitations.

The Next Big Generation

Why 5G is the 'next big thing' that will drive growth in a wide range of mark...

Blogs - Security (more)

Data Vs. Physics

How and where data gets scrubbed will have significant consequences.

What Does Cybersecurity Have To Do With Semiconductors?

Key elements of a comprehensive IoT security solution.

Scaling To Meet Engineering Challenges In Transportation

The mobility market is transitioning from mostly off-the-shelf sensors to bes...

Blogs - SLD (more)

It’s All About The Data

From AI to Moore's Law, the entire industry is deep in the throes of massive ...

Top Stories For 2018

Which articles were the most popular during 2018? Some new categories are eme...

Five Rules For Correlating Rule-based And Field Solver Parasitic Extraction Results

Accurately determine parasitic effects with the proper set up of two differen...

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

EDA For Manufacturability (more)

Crossing The Chasm: Uniting SoC And Package Verification

EDA companies, OSATs, and foundries must collaborate to ensure wafer-level pa...

Will EUV Kill Multi-Patterning?

Even with EUV in play, i193 multi-patterning may still be the most cost effec...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Embedded Insights (more)

Five steps to successful threat modeling

How to build a security plan and put it into action.

Reducing Time To Market For Security Solutions

Complex regulatory requirements and the time it takes to make security soluti...

When The IoT Really Works

A look at the necessary ingredients to transform businesses.

Foundry Forum (more)

Samsung Foundry’s Business Strategy

A look at manufacturing changes and advanced technology updates.

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

ImPatterning (more)

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to cr...

ReRAM Gains Even More Steam

Latest manufacturing techniques are being explored as commercial products beg...

Molecular Imprints becomes a virtual reality company

Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.

Inside Big Data (more)

Is It Safe To Assume That All “Passed” Die Are Actually “Good” Die?

Detecting tricky test escapes and preventing defective parts from getting int...

Are All Known Good Tested Devices Created Equal?

Post-mortem on RMAs backed by Big Data Analytics prove otherwise.

A More Efficient Way To Calculate Device Specs Of Thousands Of Tests For Improved Quality And Yield

Using actual device performance data is a critical safeguard to ensure qualit...

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

AI’s Growing Impact On Chip Design

Synopsys' chairman looks at what really got the AI explosion rolling and what...

Week in Review: IoT, Security, Auto

IoT advances; German hacking; Faraday’s future.

Data Vs. Physics

How and where data gets scrubbed will have significant consequences.

Knowledge Central (more)

Major Growth For Knowledge Center

An update on the Knowledge Center, plus a few pop quizzes.

Industry Collaboration Starts

Check out all the new stuff...And this is just the beginning.

Welcome To The Knowledge Center

There are more than 1,600 information pages already in the system, and many m...

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Computer Vision Sees a Bright Future

Using high-level synthesis to address changing algorithms, specifications and...

Developing Smarter, Safer Cars with ADAS IP

Optimize performance, safety, and reliability in ADAS applications via a holi...

Hardware Mathematics for Artificial Intelligence

Why math and a library of mathematical IP cores is important for AI.

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing and Design (more)

Manufacturing Bits: Jan. 14

Tracking cell movement; skin structure; super microscopy.

Week In Review: Manufacturing, Test

SEMI’s ISS recap; ATE concerns; trouble at Russian foundry?

Manufacturing Bits: Jan. 8

Atom interferometry; quantum measurements; climate funding.

News (more)

Blog Review: Jan. 16

FPGAs adopt formal; RISC-V cores; the importance of seals.

Week In Review: Manufacturing, Test

SEMI’s ISS recap; ATE concerns; trouble at Russian foundry?

Week in Review: IoT, Security, Auto

IoT advances; German hacking; Faraday’s future.

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Packaging and Test (more)

Testing AI Systems

What exactly are we trying to accomplish? So far, that's not clear.

More 2.5D/3D, Fan-Out Packages Ahead

Progress on 3D-ICs, using HBM with fan-outs, and other new approaches.

Chasing Reliability In Automotive Electronics

Supply chain changes, resistance to sharing data and technology unknowns add ...

Power Architect (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Green Computing: GPUs Strike Back

Speed matters, but so does efficiency.

Making Waves In Deep Learning

How deep learning applications will map onto a chip.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: Jan. 14

Tracking cell movement; skin structure; super microscopy.

System Bits: Jan. 14

Integrated photonics; cloud alternative; ultra-sensitive sensor.

Power/Performance Bits: Jan. 14

Optical memory; millimeter wave light modulator; origami RF filter.

Round Tables (more)

Machine Learning For IC Production

Experts at the Table, part 3: Where can this technology be applied and what...

IoT Device Security Makes Slow Progress

Experts at the Table: While attention is being paid to security in IoT device...

Reducing Advanced Packaging Costs

Experts at the Table, Part 2: What's needed to make different packaging appro...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

Chasing Reliability In Automotive Electronics

Supply chain changes, resistance to sharing data and technology unknowns add ...

What’s the Right Path For Scaling?

New architectures, packaging approaches gain ground as costs increase, but sh...

The Cost Of Accuracy

Accuracy is a relative term that complicates design and verification. Machine...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

Kumu Networks: Full Duplex on One Channel

Well-funded startup offers self-interference cancellation tech for single-fre...

A New Approach to Metrology

Startup has a new leading-edge technology in metrology based on differential ...

Training a Neural Network to Fall

A cautionary tale of an early attempt to put AI on an IoT system that detects...

System-Level Design (more)

Blog Review: Jan. 16

FPGAs adopt formal; RISC-V cores; the importance of seals.

System Bits: Jan. 14

Integrated photonics; cloud alternative; ultra-sensitive sensor.

Week In Review: Design, Low Power

QuickLogic buys sensor software startup; hybrid DSP/controller; GDDR6 IP.

Technical Papers (more)

Machine Learning Based Prediction: Health Behavior on BP

ML algorithm + individual data = personalized recommendations to reduce blood...

Autonomous Vehicle Navigation in Rural Environments without Detailed Prior Maps (MIT)

Self-driving technology for back roads

Silicon CMOS Architecture For A Spin-based Quantum Computer

UNSW researchers have shown how a quantum computer can be manufactured using ...

The Connected Perspective (more)

2017: A Good Year for ATE

Test equipment sales were up, and so were the share prices of ATE stocks.

That Was The Year That Was In Test

2017 featured a big proposed acquisition.

2017 ITC Wrap-up

News from Advantest, Optimal+, Astronics Test Systems.

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

AI’s Growing Impact On Chip Design

Synopsys' chairman looks at what really got the AI explosion rolling and what...

Machine Learning For IC Production

Experts at the Table, part 3: Where can this technology be applied and what...

More 2.5D/3D, Fan-Out Packages Ahead

Progress on 3D-ICs, using HBM with fan-outs, and other new approaches.

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

Testing Post

Manufacturing Bits: Dec. 18

Gallium oxide breakthroughs; super-junction SiC; groovy MOSFETs.

Cost Analysis of a Wet Etch TSV Reveal Process

How to scale through-silicon vias and improve industry adoption.

Videos (more)

AI In Chip Manufacturing

How AI with knowledge transfer can significantly decrease error rates and imp...

Edge Inferencing Challenges

Balancing different variables to improve performance.

More Than A Core

A system-level look at integration, security, and new architectures such as R...

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

Computer Vision Sees a Bright Future

Using high-level synthesis to address changing algorithms, specifications and...

Developing Smarter, Safer Cars with ADAS IP

Optimize performance, safety, and reliability in ADAS applications via a holi...

Hardware Mathematics for Artificial Intelligence

Why math and a library of mathematical IP cores is important for AI.


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