GDDR6 PHYs: From The Data Center To Self-Driving Cars


The demand for ever-increasing bandwidth has resulted in a growing interest in GDDR across a number of market verticals, including data centers and the automotive sector. As an example of the former, deep learning applications require ever-increasing speed and bandwidth memory solutions in the data center. In deep learning and other emerging technologies, GDDR memory can help companies addre... » read more

The Data Center In 2018 And Beyond


As computing continues to evolve, a number of trends are continuing to challenge the design of conventional von Neumann architectures, and in turn are driving the development of new architectural approaches and technologies. These include the growing adoption of artificial intelligence (AI), machine learning, AR/VR, IoT, high-speed financial transactions, self-driving vehicles, and blockchain/c... » read more

Optimizing The Data Center With PCI Express 4.0


PCI Express (Peripheral Component Interconnect Express), also known as PCIe, is a high-speed serial computer expansion bus standard designed to replace older PCI, PCI-X and AGP bus standards. Officially launched in 2003, PCIe was rapidly adopted by chip, system and software designers and emerged as the dominant interface standard for connecting peripherals to the CPU. Modern CPUs rely on the... » read more

The Promises And Challenges Of 7nm


Despite a waning Moore’s Law and the increasing costs of advanced process nodes, the semiconductor industry is steadily approaching 7 nanometers (nm). The demand for 7nm is driving expected initial tape-outs from fabs by the end of 2017, with initial volumes beginning in 2018 and ramping up by 2019. Silicon fabbed on 7nm nodes will offer a number of benefits for chipmakers, including lower po... » read more

Industry Heavyweights Eye High-Speed DDR4 Server DIMM Chipsets


DDR3 server DIMM chipsets (800 Mbps) first hit the market in 2006 and began to ramp the following year. By the time DDR4 server DIMM chipsets (2133) began shipping in 2014, DDR3 server DIMM chipsets were spanning the following five speeds: 800, 1066, 1333, 1600 and 1866. In the last years, DDR4 buffer chipset shipments have crossed over in term of volume, with DDR4 chipset speeds expected to... » read more

NVDIMM Market Buoyed By Evolving Data Center Demands


The NVDIMM market A recent report published by Transparency Market Research (TMR) confirms that the global Non-Volatile Dual In-line Memory Module (NVDIMM) market is being propelled by an increased demand for advanced data center infrastructure. Indeed, NVDIMMs offer fault-tolerant data integrity, while simultaneously optimizing the performance of storage and cache, as well as indexing, messag... » read more

Enabling Higher System Performance With NVDIMM-N


The shift from the traditional enterprise data center to the cloud is driving an insatiable demand for increased bandwidth and lower latencies. This is fundamentally reshaping traditional memory, storage, network and computing architectures. Although the semiconductor industry has been innovating to meet the needs of these new architectures, it continues to grapple with a waning Moore’s Law t... » read more

Memory Buffer Chips: Satisfying Amdahl’s Law To Sustain Moore’s Law


Moore’s Law, the observation that the available transistors in an integrated circuit doubles every two years, has driven the semiconductor and IT industries to unparalleled growth over the last 50+ years. These transistors have been used in CPUs to increase the number of parallel execution units and instruction fetches, expand the levels of on-chip cache (and overall capacity), support spe... » read more

From SerDes Chiplets To Die-To-Die Interfaces


The demand for ever faster high-speed interfaces has never been quite so pronounced. In our increasingly connected world, petabytes of data are continuously generated by a wide range of devices, systems and IoT endpoints such as vehicles, wearables, smartphones and even appliances. The resulting digital tsunami has prompted industry heavyweights like Google, Microsoft, Facebook and Amazon to co... » read more

The SerDes – Terabit Ethernet Connection


400 Gigabit Ethernet (400GbE) and 200 Gigabit Ethernet (200GbE) are currently slated for official release by the IEEE P802.3cd Task Force in December 2017. Although there is not yet an official IEEE roadmap detailing what lies beyond 400GbE, doubling to 800GbE will likely become a reality when single-lane 112Gbps links hits the market. This technology will allow for larger lane bundles, providi... » read more

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