China Ramps Up Power IC Manufacturing

In addition to changes in power devices being implemented to meet market trends that I discussed in previous posts, there are significant shifts taking place in the locations where these components are manufactured. Over the past 10 years, we’ve seen an increase in power device manufacturing in China, Europe and South East Asia and a subsequent drop off in North America. If we look at ... » read more

Will III-V Power Devices Happen?

In a previous blog post, I provided a review of the overall power device market and trends driving changes in device evolution that entail materials innovation. For the industry to make such a shift, the advantages over mature, low-cost silicon technologies must be compelling and something the industry absolutely has to implement. Now I’d like to focus on new materials offering competitive be... » read more

Fins And Wires – How Do We Get To 5nm?

As the industry moves beyond 10nm to the 7nm and 5nm nodes, fundamental shifts are needed to address scaling challenges. Among the priority concerns driving industry changes, particularly with respect to materials and architecture, is the impact on transistor performance from rising parasitic resistance and parasitic capacitance or RC. I spoke about this industry dilemma recently at the SEMICON... » read more

Material And Process Challenges In A Changing Memory Landscape

Moore’s Law has fueled the semiconductor industry’s growth for decades. But as the complexity of scaling increases, extending the economics of Moore’s Law is becoming a challenge. One example illustrating the challenges of maintaining the economic benefits of Moore’s Law is the difficulty of IC chip patterning. Today, this requires an expensive litho scanner, a complicated spacer and... » read more

Overcoming RC In Memory Scaling

In a memory device, Ohmic contacts (semiconductor-to-metal interfaces) connect the active region and the metal wiring. To achieve rapid and maximal charge transmission across the Ohmic contact, a low-resistivity material is used. Low-resistivity Co silicide has been adopted as the industry standard for this purpose; its effectiveness relies on the deposition of a sufficiently thick layer to for... » read more

RC Delay: Bottleneck To Scaling

R = resistance — the difficulty an electrical current has in passing through a conducting material. C = capacitance — the degree to which an insulating material holds a charge. RC delay = the delay in signal speed through the circuit wiring as a result of these two effects. RC delay is important because it can become a significant obstacle to continued downward scaling of logic and... » read more

Display Landscape Heats Up At CES 2016

I was one of the 170,000+ people who attended the 2016 Consumer Electronics Show in Las Vegas earlier this month and thought I’d share some observations; first, about the consumer technologies on exhibit, and second, about the topic closest to my heart, displays. To learn what technologies were trending, you don’t need to look any further than Intel CEO Brian Krzanich's keynote speech. ... » read more

Next Generation Technology For Flexible OLED Displays

By Max McDaniel James Xiao, vice president and general manager of the Display CVD & EPG Division, AKT, at Applied Materials, provides a high-level overview of new thin film encapsulation technology to enable the volume production of high-resolution, thin and lightweight flexible OLED displays for mobile products and TVs. He discusses the challenges for OLED manufacturing and how new technolo... » read more

Patterning Interconnects At 10nm And Below

By Connie Duncan Chip manufacturers today build billions of transistors on a chip, delivering incredible computing power to consumers. What often gets overlooked is how hard it’s getting to create the many miles of ultra-thin copper wiring used to connect each of the transistors. Patterning these electrical pathways is becoming increasingly challenging as they grow denser and finer, and any ... » read more

The Future Is Flexible

For the next installment in my display survey series, I will focus on advanced display technologies coming down the pipeline and how materials engineering solutions will enable tomorrow’s TVs and mobile devices to be flexible, bendable and foldable. [caption id="attachment_20529" align="alignnone" width="438"] Source: Samsung[/caption] I touched on this topic at the recent SID Display W... » read more

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