The Materials Gap


When consolidation thinned the ranks of semiconductor foundries and equipment makers, materials companies figured things were about to get better. They haven't. There are a couple of reasons for this. First, semiconductors are now so complex and difficult to develop that a slew of innovations are required on all sides. Everyone is familiar with transistor structures, interconnects and lithog... » read more

Machine Learning In The Fab


Machine learning is exploding, especially where there are massive amounts of data to contend with and lots of potential interactions. This leads to two obvious insertion points in the semiconductor field. One is on the design side, where just getting an advanced design to function is an enormous challenge. That challenge increases as the need for reliability in some market increases. It's d... » read more

Can A Supply Chain Be Too Efficient?


The semiconductor industry is a model of efficiency—literally. When other industries look at adding smart manufacturing into their operations, they often look to chip manufacturing as a shining example. After decades of business gyrations, semiconductor companies have figured out how to instill efficiency into every aspect of making chips. This is evident in device scaling. At 90nm, the co... » read more

Architecture First, Node Second


What a difference a node makes. A couple of rather important changes have occurred in the move from 16/14 to 10/7nm (aside from more confusing naming conventions). First, companies that require more transistors—processor companies such as [getentity id="22846" e_name="Intel"], AMD, [getentity id="22306" comment="IBM"] and [getentity id="22676" e_name="Qualcomm"]—have come to grips with t... » read more

High-Stakes Litho Game


The commercial introduction of EUV looks all but assured these days. There is enough history to show it works. Uptime and throughput are improving, and systems are shipping today. The question now is how to measure its success. In the short-term, this is a fairly simple financial exercise for companies like ASML and Zeiss, which have been closely collaborating to get these massive systems ou... » read more

The Evolution Of EUV


EUV systems are beginning to ship to large foundries in volume, setting the stage for one of the biggest leaps in technology the semiconductor industry has ever witnessed. ASML has emerged as the sole supplier in this market, but it has taken an entire ecosystem to develop EUV. It has taken billions of dollars of investment by ASML, along with enormous cash infusions by Intel and TSMC, contr... » read more

Playing With Chip Volumes


The overall market for semiconductors continues to grow, but the number of applications that will generate enormous volumes continues to shrink. In theory, this is good for the overall semiconductor industry, but it raises important questions about where R&D dollars will go in the future. The fundamental problem is that the semiconductor business is a volume business for one or two markets. ... » read more

The Return Of Time Sharing


As early as the 1960s, it wasn't uncommon to hear that transistors would be free. Those were pretty bold statements at the time, considering most computers in those days cost $1 million, required special rooms, and budding computer scientists usually had to sign up to use mainframe computers for one-hour time slots—often in the middle of the night or on weekends. Still, those predictions ... » read more

Putting The Brakes On Consolidation


China's efforts to reduce its trade deficit by acquiring technology outside of its borders—particularly in the areas of process technology and memory—are hitting some snags. Any proposed acquisitions are being closely monitored by government agencies around the globe, and in many cases they have been quietly derailed. The Committee on Foreign Investment in the United States (CFIUS) is pa... » read more

Advanced Packaging Requires Better Yield


Whether Moore's Laws truly ends, or whether the semiconductor industry reaches into the Angstrom world after 3nm—the semiconductor industry dislikes fractions—advanced packaging increasingly will dominate semiconductor designs. Apple already is on board with its iPhone 7, using TSMC's fan-out approach. And all of the major foundries and OSATs are lining up with a long list of capabilitie... » read more

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