What’s In The Package?


Putting a variety of chips or hardened IP blocks into a package rather than trying to cram them into a single chip continues to gain ground. But it's also creating its own set of issues around verifying and testing these devices. This problem is well understood inside of SoCs, where everything is integrated into a single die. And looked at from a 30,000-foot perspective, packaging is someth... » read more

ATE Tailwind For 2018?


The automatic test equipment market enjoyed a record sales year during 2017, and there are indications that the good times will continue this year. Forecasters are predicting another robust year for sales of DRAMs and NAND flash memory devices, especially 3D NAND. That will drive demand for memory test equipment to keep up. Frost & Sullivan predicts semiconductor test equipment will h... » read more

Walk A Mile In Their Shoes


To most of us, when we think about how artificial intelligence (AI) enhances our mobility, the most top-of-mind examples might be how our smart phones respond to voice commands when we ask for directions to the nearest coffee shop or the current weather at the location to which we’re heading. But for people missing limbs, AI has the potential to give them the mobility that they might never ha... » read more

System-Level Simulation Of Technologies Supporting Enhanced Spectral Efficiency For 5G New Radio


By Gent Paparisto, Joel Kirshman, and David Vye 5G New Radio (5G NR) is the wireless standard defining the next generation of mobile networks. 5G will offer higher capacity than current 4G, enabling a higher density of mobile broadband users and supporting device-to-device and massive-machine communications. 5G research and development will support lower latency, improved reliability, and... » read more

5G Makes Its Public Debut At The Winter Games


We have been spending considerable time and effort with our customers deep in the development of technology that will enable next-generation communications. Work on 5G technology has been underway for several years now-long before the general public will experience its amazing capabilities. So when will this next-generation technology be ready? You'll get a first look next month at the Winte... » read more

Advanced Packaging Still Not So Simple


The promise of advanced packaging comes in multiple areas, but no single packaging approach addresses all of them. This is why there is still no clear winner in the packaging world. There are clear performance benefits, because the distance between two chips in a package can be significantly shorter than the distance that signals have to travel from one side of a die to another. Moreover, wi... » read more

2017: A Good Year for ATE


The rising revenue enjoyed by automatic test equipment vendors in 2017 translated into soaring stock prices for some publicly held companies. The Dow Jones Industrial Average was up 25% for 2017. Advantest’s shares traded on the Tokyo Stock Exchange had a 2017 low of 1,787 yen (about $15.85 at the year-end currency exchange rate) and a 52-week high of 2,698 yen ($23.92), up 51% from the... » read more

The Quantum Man Effect


Recently I saw an art exhibit by one of my favorite artists, Julian Voss-Andreae, a German-born sculptor now living and working in Portland, Oregon. In addition to sculpting, he has studied physics, mathematics and philosophy. His background in science has informed and influenced his career in the arts, leading to his creation of pieces such as protein sculptures, based on frames of a protein f... » read more

How To Deal With The Flood Of Analog Data


Analog data from a variety of sensors and other devices is a huge problem. Here are three approaches to overcoming the problems that big analog data can cause. Approach 1: Analyze at the Edge A lot of data can be collected at the point of capture, but most of it’s uninteresting. You can save and analyze it all or you can take advantage of intelligent embedded software that constantly meas... » read more

Advanced Packaging Is Suddenly Very Cool


The hottest chip markets today—automotive AI for autonomous and heavily assisted driving, machine learning, virtual and augmented reality—all are beginning to look at advanced packaging as the best path forward for improving performance and reducing power. Over the past four years, which is when 2.5D and fan-out wafer-level packaging first really began garnering interest, these and othe... » read more

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