Blog Review: May 23


Cadence's Paul McLellan digs into the problems of test for 3D ICs s well as new approaches to cell-aware test, modular test and realistic IR drop at CDNLive EMEA. Mentor's Colin Walls shares four more embedded software tips, including always initializing a variable and when to use ++i instead of i++. Synopsys' Taylor Armerding points to a new way that phishing attacks could get around Mic... » read more

The Week In Review: Manufacturing


Fab tools and test VLSI Research released its annual "Customer Satisfaction Survey" and listed "THE BEST Suppliers" of 2018. VLSI Research received feedback from more than 94% of the chip market and 76% of subsystems customers for this year’s survey. Who are the winners? Applied Materials reported its second quarter results, along with its business outlook. Compared to the second quarter ... » read more

The Week in Review: IoT


Conferences Keynote highlights from the Internet of Things World 2018 conference: “Safety is the most important thing,” said Russ Benson, vice president of IT product systems at Boeing; “It’s all about data,” said Juan Perez, chief information officer and chief engineering officer of UPS; “Semiconductors accelerate IoT growth,” said Tony Keirouz, vice president of IoT strategy, e... » read more

The Week In Review: Design


Tools & IP Synopsys uncorked ASIL B, C, and D ready versions of its DesignWare EV6x Embedded Vision Processors for automotive SoCs. An included Safety Enhancement Package provides hardware safety features, safety monitors, and lockstep capabilities for safety-critical designs. The processors integrate scalar, vector DSP, and CNN processing units for automotive systems that require deep lea... » read more

Blog Review: May 16


Synopsys' Eric Huang looks back at why the USB On-The-Go specification was revolutionary in getting devices talking to each other and how the shift to USB Type-C and Dual Mode means it isn't needed anymore. Mentor's Andrew Macleod examines four different shift-left methodologies and the benefits of each in the context of automotive and autonomous vehicle design. Cadence's Paul McLellan ch... » read more

The Week In Review: Manufacturing


Test and packaging In a major surprise, Cohu has entered into a definitive agreement to acquire Xcerra for approximately $796 million. With the deal, Cohu will enter the ATE market. Last year, a group from China entered into a definitive agreement under which it would acquire Xcerra. But the U.S. blocked Xcerra’s sale to the Chinese group. Ironically, at one time, Cohu was reportedly lobbyin... » read more

The Week In Review: Design


M&A IoT-focused memory chipmaker Adesto Technologies acquired S3 Semiconductors, a provider of mixed-signal and RF ASICs and IP. Based in Ireland, S3 Semiconductors was founded in 1986. S3 Semiconductors will become a business unit of Adesto and will continue to operate under its current model in the $35 million deal. S3 Semiconductor's parent company, S3 Group, will continue as a separate... » read more

The Week in Review: IoT


Conferences Internet of Things World 2018 takes place next week at the Santa Clara Convention Center in Silicon Valley. Executives of GE Digital, The Chamberlain Group, and UPS will be among those giving keynote addresses during the four-day conference. Monday will see pre-conference workshops, followed by three days of keynotes, presentations, and an expo floor taking in 100,000 square feet o... » read more

Blog Review: May 9


Mentor's Doug Amos explains the differences (and similarities) between verification and validation, why switching between engines needs to be simpler, and why the limits of verification are driving a growth in validation importance. Synopsys' Melissa Kirschner provides a primer on 5G and the five technologies that will need to work in tandem to bring the promised high speeds and low latency.... » read more

The Week In Review: Manufacturing


Chipmakers Consumers recently filed a class-action suit against the three DRAM makers, alleging that they illegally agreed to raise prices for their respective memory products. The suit, filed in the U.S. District Court for the Northern District of California, alleges that Samsung, Micron and Hynix agreed to limit the supply of DRAM, driving up prices for this widely used memory. The pr... » read more

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