The Week In Review: Manufacturing


Market research For the first time since 1993, the semiconductor industry has a new number one supplier in terms of sales—Samsung. Samsung is forecast to top Intel as the #1 semiconductor supplier in 2017, according to IC Insights. "Samsung first charged into the top spot in 2Q17 and displaced Intel, which had held the number 1 ranking since 1993," according to the firm. "In 1Q16, Intel’s ... » read more

The Week in Review: IoT


Commentary Chris Voce of Forrester Research writes that the Internet of Things next year will move beyond experimentation in this piece. “At Forrester we believe IoT extends beyond devices and connectivity,” he writes. “But it's the business impact of IoT that truly defines what it is: the insights that you can derive with analytics and the business outcomes you can achieve.” M&A M... » read more

Week In Review: Design


Acquisitions Marvell signed a definitive agreement to buy Cavium for roughly $6 billion. The deal is expected to close in mid-2018. The Cavium deal fits squarely on the cloud side and gives Marvell a much bigger reach into enterprise networking and infrastructure, as well as some developing markets. Siemens paid an undisclosed price to buy Solido Design Automation, which tracks variation i... » read more

Blog Review: Nov. 22


ARM's Jem Davies talks about an upcoming documentary on AI and where the lines need to be drawn between machine intelligence and human emotional intelligence. Mentor's Saunder Peng examines the impact of merging physical verification databases, which can cost time and resources, and how that can be streamlined. Cadence's Paul McClellan takes a look back at the Xerox Alto and how it change... » read more

The Week In Review: Manufacturing


Market research For some time, DRAM shortages have plagued the market. Today, the situation remains the same. DRAMs are seeing strong demand. But yet, vendors are not adding any capacity. “Strained DRAM supply was even more evident during the third quarter as limited production capacity and limited technological progress for the memory industry encountered robust demand from data centers in ... » read more

The Week in Review: IoT


Investment The city of Dresden, Germany, is touting its prospects as a tech hub in the “Silicon Saxony” ecosystem, particularly for Internet of Things technology. Bosch, the German Aerospace Center, GlobalFoundries, Infineon Technologies, and other organizations are planning to invest about €4.5 billion (approximately $5.3 billion) over several years to develop processors, sensors, and 5... » read more

The Week In Review: Design


Tools Aldec released the latest version of its Riviera-PRO verification platform, adding QEMU Bridge to enable hardware/software co-simulation of designs intended to run on SoC FPGAs. Other features include improved performance when using code containing many inline randomized calls and up to 29% faster simulation speed of UVM. Pulsic added new features to its Unity Bus Planner for planning... » read more

Blog Review: Nov. 15


Cadence's Paul McLellan shares highlights from the Jasper User Group, including what to do when formal is not converging on a proof and formal in use at Arm. Synopsys' Anders Nordstrom explains how formal can verify SoC interconnects and get you from San Jose to Austin. Mentor's Jeff Miller argues that intelligent sensors are the basic building block for the IoT, and the market is growing... » read more

The Week In Review: Manufacturing


Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

The Week in Review: IoT


Security Mocana said it is working with Avnet, Infineon Technologies, Microsoft, and Xilinx to provide Industrial Internet of Things systems that meet cybersecurity standards. The systems utilize the Avnet UltraZed-EG system-on-module, Mocana’s security software running on the Xilinx Zynq Ultrascale+ MPSoc, and Infineon’s OPTIGA Trusted Platform Module 2.0 security chip. The Microsoft Azur... » read more

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