category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Silent Data Corruption Considerations For Advanced Node Designs
By Jyotika Athavale - 12 Mar, 2024 - Comments: 0

Ensuring reliability, availability, and serviceability (RAS) has long been an important consideration for many types of electronic systems, with major implications for chip design. Clearly, military hardware must be very reliable, and servers and automotive systems are also expected to be available constantly. Some amount of failure is inevitable, so being able to repair, avoid, or mitigate fau... » read more

DTCO/STCO Create Path For Faster Yield Ramps
By Laura Peters - 12 Mar, 2024 - Comments: 0

Higher density in planar SoCs and advanced packages, coupled with more complex interactions and dependencies between various components, are permitting systematic defects to escape traditional detection methods. These issues increasingly are not detected until the chips reach high-volume manufacturing, slowing the yield ramp and bumping up costs. To combat these problems, IDMs and systems co... » read more

Reaching For The Stars: Embracing Non-Terrestrial Networks In The Age Of 5G And Beyond
By Alejandro Escobar Calderon - 12 Mar, 2024 - Comments: 0

In the realm of modern connectivity, the race towards faster, more reliable networks has been relentless. With the advent of 5G technology, humanity is on the brink of a new era of communication, promising unprecedented speeds and capabilities. However, as we stand on the precipice of this digital revolution, it's imperative to look beyond the terrestrial confines that have defined our networks... » read more

AI/ML Challenges In Test and Metrology
By Gregory Haley - 12 Mar, 2024 - Comments: 0

The integration of artificial intelligence and machine learning (AI/ML) into semiconductor test and metrology is redefining the landscape for chip fabrication, which will be essential at advanced nodes and in increasingly dense advanced packages. Fabs today are inundated by vast amounts of data collected across multiple manufacturing processes, and AI/ML solutions are viewed as essential for... » read more

X-ray Inspection In The Semiconductor Industry
By Chris Rand - 12 Mar, 2024 - Comments: 0

With the ever-present pressure to produce more efficient devices with more power, the sizes of the structures and electrical connections in the production of chips have become smaller and smaller. In addition, the sheer number of these connections in a given unit area have also increased in a spectacular way. At the heart of all X-ray inspection, whether it is manual or fully automated metrolog... » read more

Laser Wavelength Selection In Raman
By Inga Koehler - 12 Mar, 2024 - Comments: 0

Laser wavelength selection, a critical determinant of accuracy and data quality, is guided by factors such as resonance, fluorescence, and sample absorption. Ensuring the correct laser wavelength leads to optimal excitation and signal strength, facilitating precise and informative analysis. Luminous evolution In the early days of Raman spectroscopy, light sources like arc lamps and incan... » read more

Strategies For Detecting Sources Of Silent Data Corruption
By Anne Meixner - 12 Mar, 2024 - Comments: 0

Engineering teams are wrestling with how to identify the root causes of silent data corruption (SDC) in a timely and cost-effective way, but the solutions are turning out to be broader and more complex than simply fixing a single defect. This is particularly vexing for data center reliability, accessibility and serviceability (RAS) engineering teams, because even the best tools and methodolo... » read more

Examining The Impact Of Chip Power Reduction On Data Center Economics
By Noam Brousard - 12 Mar, 2024 - Comments: 1

In the rapidly evolving landscape of data centers, optimizing energy consumption has become a critical focus. In this blog post, we'll delve into the intricacies of power consumption, exploring the economics of three key components: CPUs, GPUs, and AI accelerators, and how the implementation of proteanTecs power reduction solution transforms both power efficiency and computational capabilities... » read more

Overcoming The Challenges Of Verifying Multi-Die Systems
By Synopsys - 12 Mar, 2024 - Comments: 0

Despite clear advantages of multi-die systems, the decision to design a multi-die system rather than a traditional monolithic SoC is not easy. There are numerous new challenges that stand in the way of multi-die system realization. This white paper focuses on the verification challenges of multi-die systems, including: Addressing capacity and performance for system verification Valid... » read more

MIMO Application Framework
By NI - 12 Mar, 2024 - Comments: 0

Massive MIMO is an exciting area of 5G wireless research. For next-generation wireless data networks, it promises significant gains that offer the ability to accommodate more users at higher data rates with better reliability while consuming less power. Using the NI Massive MIMO Software Architecture, researchers can build Massive MIMO testbeds to rapidly prototype large-scale antenna systems u... » read more

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