category: Top Stories

category: IoT, Security & Automotive

Accellera Preps New Standard For Clock-Domain Crossing
By Brian Bailey - 29 Feb, 2024 - Comments: 0

Part of the hierarchical development flow is about to get a lot simpler, thanks to a new standard being created by Accellera. What is less clear is how long will it take before users see any benefit. At the register transfer level (RTL), when a data signal passes between two flip flops, it initially is assumed that clocks are perfect. After clock-tree synthesis and place-and-route are perfor... » read more

Thinking Big: From Chips To Systems
By Ed Sperling - 27 Feb, 2024 - Comments: 0

Semiconductor Engineering sat down with Aart de Geus, executive chair and founder of Synopsys, to talk about the shift from chips to systems, next-generation transistors, and what's required to build multi-die devices in the context of rapid change and other systems. SE: What are the biggest changes you're seeing in the chip industry these days, and why now? de Geus: It's not just the siz... » read more

Latency, Interconnects, And Poker
By Ed Sperling - 20 Feb, 2024 - Comments: 0

Semiconductor Engineering sat down with Larry Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, and the winner of this year's Phil Kaufman Award for Pioneering Contributions. What follows are excerpts of that conversation. SE: When did you first get started working in semiconductors — and particularly, EDA? Pileggi: This w... » read more

Formal Verification’s Usefulness Widens
By Ann Mutschler - 31 Jan, 2024 - Comments: 0

Formal verification is being deployed more often and in more places in chip designs as the number of possible interactions grows, and as those chips are used in more critical applications. In the past, much of formal verification was focused on whether a chip would function properly. But as designs become more complex and heterogeneous, and as use cases change, formal verification is being u... » read more

Why There Are Still No Commercial 3D-ICs
By Brian Bailey - 29 Jan, 2024 - Comments: 0

Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that must be overcome and new tools that need to be developed. In contrast, the semiconductor industry is becoming fairly comfortable with 2.5D integration, where individual dies are assembled on some k... » read more

EDA Back On Investors’ Radar
By Brian Bailey - 25 Jan, 2024 - Comments: 0

EDA is transforming from a staid but strategic sector into a hot investment market, fueled by strong earnings and growth, a clamoring for leading-edge and increasingly customized designs across new and existing markets, and the rollout of advanced technologies such as AI for a range of tools that will be needed to develop new architectures with much greater performance per watt. A confluence... » read more

IC Tool Vendors Eye Cloud-Native Future
By Aharon Etengoff - 25 Jan, 2024 - Comments: 0

The promise of scalability and efficiency is accelerating the migration of electronic design automation (EDA) to the cloud. Unlimited on-demand compute resources fundamentally change the chip design paradigm, where tools and workloads are no longer constrained by localized hardware. This is easier said than done, however. Optimizing existing tools and infrastructure, creating a new generatio... » read more

Shifting Left Using Model-Based Engineering
By Karen Heyman - 25 Jan, 2024 - Comments: 0

As heterogenous integration increases design complexity and forces engineers out of long-standing silos, model-based engineering (MBSE) is becoming essential for improving quality and reducing failures in the field. While it may seem like a new buzzword, MBSE's principles date back to the 1990s. In essence, it's a process of building models that enable early decisions, which pays off in fewe... » read more

Top Tech Videos of 2023
By Liz Allan - 29 Dec, 2023 - Comments: 0

In 2023, heterogeneous integration, RISC-V, and advanced node logic scaling and advanced packaging dominated the semiconductor industry. All of those topics spurred deep discussions at conferences, and they were the subject of Semiconductor Engineering's most popular videos. Of the videos published in 2023, here are the highlights from our five channels: Manufacturing, Packaging & Mater... » read more

RISC-V Micro-Architectural Verification
By Brian Bailey - 21 Dec, 2023 - Comments: 3

RISC-V processors are garnering a lot of attention due to their flexibility and extensibility, but without an efficient and effective verification strategy, buggy implementations may lead to industry problems. Prior to RISC-V, processor verification almost became a lost art for most semiconductor companies. Expertise was condensed into the few commercial companies that provided processors or... » read more

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