Embedded Die Packaging Emerges


Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

Wireless Test Faces New Challenges


Your mobile phone is far more complex than it was even five years ago, and it’s about to become even more complex with new wireless technologies. That has set off a scramble among test equipment vendors to come up with solutions, methodologies and equipment that is affordable, effective and reliable enough to make sure all of this technology works as planned—and that it continues to work th... » read more

New Shifts In Automotive Design


Four big shifts in automotive design and usage are beginning to converge—electrification, increasing connectivity, autonomous driving and car sharing—creating a ripple effect across the automotive electronics supply chain. Over the past few years the electronic content of cars and other vehicles has surged, with electrical systems replacing traditional mechanical and electro-mechanical s... » read more

Where Is Energy Harvesting?


With power management a top priority in sensor networks, why is energy harvesting—a proven technology with diverse energy sources—conspicuously absent from sensor designs that are the foundation of the Internet of Things? [getkc id="165" kc_name="Energy harvesting"] always has been a promising answer to the limits of battery power. The idea that a device can run for much longer periods o... » read more

EDA: 8 Consecutive Years Of Growth


The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) reported today that revenue for Electronic Design Automation (EDA) industry increased 10.7 percent for Q4 2017 to $2718.6 million, compared to $2455 million in Q4 2016. The four-quarters moving average was up by 9.5 percent. This compares the most recent four quarters to the prior four quarters. "It was a terrific qu... » read more

Mesh Networking Grows For ICs


Mesh networks were invented to create rich interaction among groups of almost-unrelated peers, but now they are showing up in everything from advanced chip packages to IoT networks. The flexibility of a many-to-many peer-connection model made the mesh approach a favorite for two-dimensional network-on-a-chip topologies, to the point where they began to supplant data-bus connections during th... » read more

How To Choose The Right Memory


When it comes to designing memory, there is no such thing as one size fits all. And given the long list of memory types and usage scenarios, system architects must be absolutely clear on the system requirements for their application. A first decision is whether or not to put the memory on the logic die as part of the SoC, or keep it as off-chip memory. "The tradeoff between latency and th... » read more

What Happened To Nanoimprint Litho?


Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separa... » read more

Who’s Responsible For Security?


Semiconductor Engineering sat down to discuss security issues and how to fix them with Mark Schaeffer, senior product marketing manager for secure solutions at Renesas Electronics; Haydn Povey, CTO of Secure Thingz; Marc Canel, vice president of security systems and technologies at [getentity id="22186" comment="Arm"]; Richard Hayton, CTO of Trustonic; Anders Holmberg, director of corporate dev... » read more

Going Deep Or Broad With Formal?


Whether to apply [getkc id="33" comment="formal verification"] technology to semiconductor design broadly or deeply is a tough question. It hinges on what is the best way to achieve maximum ROI. Do you want to identify hard to find bugs, and get a certain level of confidence about a block? Where should the effort be placed? Is it by going deep, meaning a team of specialists or experts must b... » read more

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