Toward System-Level Test


The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single operation that is performed during manufacturing. In reality it is a portfolio of separate operations, and the number of tests required is growing as designs become more heterogeneous and as they ar... » read more

Integrated Passives Market Gets Active


Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses. Europe is leading the way in supplying IPDs, thanks to offerings from Infineon Technologies, STMicroelectronics, a... » read more

Advanced Packaging’s Progress


Shim Il Kwon, CTO at STATS ChipPAC, sat down with Semiconductor Engineering to discuss the current and future trends of chip packaging. What follows are excerpts of that conversation. SE: The outsourced semiconductor assembly and test (OSAT) vendors provide third-party IC-packaging and test services. What are the big challenges for OSATs today? Shim: The OSAT market is very competitive, w... » read more

Functional Safety Issues Rising


Developing semiconductors for safety-critical markets such as automotive, industrial and medical involves a growing list of extra steps that need to be taken pre- and post-manufacturing to ensure product integrity, reliability and security. This is causing several significant changes: • Designs are becoming much more complicated because they require such features as failover and redundan... » read more

What’s Next for the IoT?


The Internet of Things continues to evolve, attempting to overcome its poor reputation for cybersecurity and making the case for wider adoption, especially by enterprises. Consumer IoT, largely represented in smart-home automation, remains a market being targeted by Amazon, Apple, Google, LG Electronics, Samsung Electronics, and other technology titans. The big bucks are in [getkc id="78" k... » read more

Ethernet’s Next Life


An ever-growing engagement with the Internet — where most of humanity and the ‘things’ we use are almost constantly connected and constantly storing, processing and retrieving data over a network — is increasing pressure to develop new standards, and much more quickly. Witness the timeline of Ethernet, and its humble beginnings as a standard protocol for moving data at 2.5 megabits p... » read more

Prototypes Proliferate


Hardware prototyping and [getkc id="30" kc_name="emulation"] have been two sides of the same coin ever since the [gettech id="31071" comment="FPGA"] became a commercial success. Early emulators were all built from FPGAs, and most were used in-circuit, much like prototypes are today. More recently, emulation has become a major piece of the [getkc id="10" kc_name="verification"] flow, to the poin... » read more

System Coverage Undefined


When is a design ready to be taped out? That has been one of the toughest questions to confront every design team, and it's the one verification engineers lose sleep over. Exhaustive [getkc id="56" kc_name="coverage"] has not been possible since the 1980s. Several metrics and methodologies have been defined to help answer the question and to raise confidence that important aspects of a block... » read more

Verifying AI, Machine Learning


[getperson id="11306" comment="Raik Brinkmann"], president and CEO of [getentity id="22395" e_name="OneSpin Solutions"], sat down to talk about artificial intelligence, machine learning, and neuromorphic chips. What follows are excerpts of that conversation. SE: What's changing in [getkc id="305" kc_name="machine learning"]? Brinkmann: There’s a real push toward computing at the edge. ... » read more

Verification’s Breaking Points


Verification efficiency and speed can vary significantly from one design to the next, and that variability is rising alongside growing design complexity. The result is a new level of unpredictability about how much it will cost to complete the verification process, whether it will meet narrow market windows, and whether quality will be traded off to get a chip out on time in the hopes that it c... » read more

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