The Week In Review: IoT


Security The Defense Advanced Research Projects Agency (DARPA) in August held the finals of its Cyber Grand Challenge, a competition that came down to seven teams in Las Vegas, with the three winning teams sharing cash prizes totaling $3.75 million. The capture-the-flag style contest let cybersecurity software counter various attacks on its own, without the aid of engineers and programmers. Th... » read more

Seeing The Future Of Vision


Vision systems have evolved from cameras that enable robots to “see” on a factory floor to a safety-critical element of the heterogeneous systems guiding autonomous vehicles, as well as other applications that call for parallel processing technology to quickly recognize objects, people, and the surrounding environment. Automotive electronics and mobile devices currently dominate embedded... » read more

Will Hypervisors Protect Us?


Another day, another car hacked and another report of a data breach. The lack of security built into electronic systems has made them a playground for the criminal world, and the industry must start becoming more responsive by adding increasingly sophisticated layers of protection. In this, the first of a two-part series, Semiconductor Engineering examines how hypervisors are entering the embed... » read more

The Week in Review: IoT


Technology The Internet of Things got some attention at this week’s Intel Developer Forum in San Francisco. Intel CEO Brian Krzanich introduced the Joule compute module in his opening-day keynote address. The module is a high-performance developer platform supporting Intel RealSense depth-sensing cameras. Canonical, Microsoft, and PivotHead were among the IDF exhibitors demonstrating the Jou... » read more

The Week In Review: Manufacturing


Fab tools Thermo Fisher Scientific and FEI have announced that their boards of directors have unanimously approved Thermo Fisher’s acquisition of FEI for $107.50 per share in cash. The transaction represents a purchase price of approximately $4.2 billion. In a video, Aki Fujimura, chief executive of D2S, recaps the emerging mask and lithography trends presented at the recent Photomask Ja... » read more

Keeping The Whole Package Cool


Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but the ability to dissipate the heat depends on the package surface area. Because the goal of 3D packaging is to squeeze more transistors into less overall space, new heat dissipation issues are em... » read more

Announcing DAC’s First Art Show


Every year DAC features something new. For the general chair, balancing tried and true conference elements with infusions of change is part of the art of putting on DAC and keeping it fresh. This year one change has to do with art itself — #53DAC features what I believe to be the first art show in the conference's long history. No, I'm not asking you to submit that painting you've been lab... » read more

What Comes Next


By Marc Heyns I’m very optimistic about the continuation of Moore’s Law. But in saying that, I’m speaking about Moore’s Law purely as an economic law. I believe we’ll be able to offer increasing amounts of functionality at lower and lower costs. And technological innovations as well as advances in design and application will be crucial in realizing this. But I don’t believe a ... » read more

Will The Chip Work?


IP is getting better, but the challenges of integrating it are getting worse. As the number of IP blocks in SoCs increases at each new process node, so does the difficulty of making them all work together. In some cases, this can mean extra code and a slight performance hit on power and performance. In other cases, it may require more drastic measures, ranging from a re-spin to a new archite... » read more

The Week In Review: Manufacturing


Upgraded components in the new iPhone 6S Plus from Apple cost $16 more than the components in the earlier iPhone 6 Plus, according to IHS, which also provided a breakdown of the phone. Both Samsung and TSMC are making Apple’s A9 applications processor on a foundry basis, according to ExtremeTech, which cites Chipworks as its source. There are reports that the Chinese government is interes... » read more

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