Primer On Packaging


Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. The external chip structure protects the fragile integrated circuits inside, as well as dissipates heat, keeps chips isolated from each other, and, importantly, provides connection to the circuit board and other elements. The manufa... » read more

In Search Of Life On The Exoplanets


Space exploration is a constant driver of scientists around the world, searching for life on planets outside our solar system (exoplanets). The news is often filled by wondrous discoveries and promising leads that point to potential life outside of Earth. This search often depends on a key piece of technology – the analog-to-digital converter (ADC) that accurately maps analog imaging to a dig... » read more

Saving Power In A UFS Implementation Leveraging MIPI M-PHY And UniPro


The JEDEC Universal Flash Storage (UFS) has become the mobile storage standard of choice for today’s high-end smartphones and tablets mainly due to the specification’s performance and power advantages over other existing solutions. These advantages become critical to meet end users’ requirements for higher responsiveness and increased capabilities. For example, end users expect to transmi... » read more

Save Time And Minimize Errors By Automating Co-Design And Co-Analysis Of Chips, PCBs, And Packages


Given the complexity of today’s chips, packages, and PCBs, designing each in isolation is no longer judicious. Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market. Such capabilities are provided by the Cadence Virtuoso System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Alleg... » read more

Simulation-Driven Product Development In Additive Manufacturing


Additive manufacturing, or 3-D printing, has the potential to radically change the way in which products are conceived and designed. The additive process allows for unprecedented design complexity and design freedoms. Full subassemblies can be produced in one print eliminating costly joining operations. Parts can be customized and produced in small, made- to-order batches. Parts can be produced... » read more

Listening To The Voice Of Your Product


Much has been said and written about the business values of the Industrial Internet of Things (IIoT). Through connecting the manufacturing elements (machines) on the factory floor, and collecting and analyzing their data, manufacturers can significantly improve the efficiency and profitability of their operations through intelligent predictive maintenance of equipment and optimal equipment ut... » read more

Massively Parallel System-Level Testing


Decades of advances in the semiconductor industry continue to drive an insatiable consumer demand for smaller, more powerful, more ubiquitous devices – whether in our cars, on our countertops or around our wrists. To meet this demand now and into the future, the fabrication of increasingly complex semiconductor systems for an incredible spectrum of applications must scale accordingly. Additio... » read more

Board Level Reliability Improvement In eWLB


When it comes to reducing form-factor and increasing functional integration of mobile devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the advancement of various fan-out WLP (FOWLP), it is a more optimal and promising solution compared to fan-in WLP because it can offer greater flexibilit... » read more

Implementing High-Density-Advanced Packaging For OSATs And Foundries


HDAP design and verification require cooperation and collaboration between design houses, OSATs, foundries, and EDA vendors. By using common tools that have the integration and functionality needed to operate in both the IC and packaging domains and by developing and deploying process optimized design-kits such as ADK’s and PDKs, OSATs, foundries, and their customers can achieve design, fabri... » read more

CryptoManager IoT Device Management


The Internet of Things (IoT) market is caught in the difficult position of needing security, but, due to the fractured nature of the market, do not have an easy way of implementing a robust security solution. The Rambus CryptoManager IoT Device Management is a turnkey device-to-cloud solution that provides seamless end-to-end secure connectivity throughout all stages of the device life-cycle. ... » read more

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