Using GPUs In Semiconductor Manufacturing


Massive simulation and curvilinear shapes are forcing the photomask industry to rethink what types of chips work best. Aki Fujimura, CEO of D2S, talks about what happens when shapes printed on a mask are closer to what actually gets printed, how GPUs can be used to accelerate CPUs in single instruction/multiple data (SIMD) operations, and why pixel data is different from other data. » read more

Next-Gen Transistors


Nanosheets, or more generally, gate-all-around FETs, mark the next big shift in transistor structures at the most advanced nodes. David Fried, vice president of computational products at Lam Research, talks with Semiconductor Engineering about the advantages of using these new transistor types, along with myriad challenges at future nodes, particularly in the area of metrology. » read more

Design Technology Co-Optimization


Rising complexity is making it increasingly difficult to optimize chips for yield and reliability. David Fried, vice president of computational products at Lam Research, examines the benefits of automated rules to manage the relationship between layout and design requirements on one side, and process flows and rules/checks on the other. Benefits include reduced margin, shortened time to market,... » read more

Open Cavity Plastic Packaging


Rapid change in electronics is also causing rapid obsolescence. But in some markets, the systems are supposed to last for decades. Sam Sadri, senior process engineer at QP Technologies (formerly Quik-Pak), talks with Semiconductor Engineering about why it’s so important to use existing package footprints, what are the challenges in replacing the circuitry inside a package, and which markets a... » read more

What’s Changing In DRAM


Most of the attention in chip scaling has been focused on logic and on-chip memory, but off-chip memory is starting to encounter problems, as well. David Fried, vice president of computational products at Lam Research, looks at the impact of shrinking features and increasing density, including variation, thermal effects and aging, as well as effects such as micro-loading and DRAM stacking. » read more

Changing The Rules For Chip Scaling


Aki Fujimura, CEO of D2S, talks with Semiconductor Engineering about the incessant drive for chip density, how to improve that density through other means than just scaling, and why this is so important for the chip industry. » read more

Virtual Fabrication At 7/5/3nm


David Fried, vice president of computational products at Lam Research, digs into virtual fabrication at the most advanced nodes, how to create models using immature processes at new nodes, and how to fuse together data from multiple different silos. » read more

Challenges At 3/2nm


David Fried, vice president of computational products at Lam Research, talks about issues at upcoming process nodes, the move to EUV lithography and nanosheet transistors, and how process variation can affect yield and device performance. » read more

Using Digital Twins And DL In Lithography


Leo Pang, chief product officer and executive vice president at D2S, looks at the results of inverse lithography technology at advanced nodes using curvilinear patterns, and how that can be combined with a digital twin and deep learning speed up time to market and reduce cost. » read more

Curvilinear Full-Chip ILT


Leo Pang, chief product officer and executive vice president at D2S, talks about the speed improvements with full-chip inverse lithography technology, why it is so critical in stitching together large chips, and how this approach differs from traditional litho approaches. » read more

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