Tech Talk: ISO 26262


Arteris' Kurt Shuler discusses what's changing in the automotive standard and how everything is supposed to work in the future. » read more

Biz Talk: ASICs


eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

Tech Talk: Timing Closure


Arteris' George Janac talks about timing closure issues in advanced chips and why this has reared its head again for the first time in a decade.   Related Stories Timing Closure Issues Resurface Adding more features and more power states is making it harder to design chips at 10nm and 7nm. » read more

Tech Talk: Earlier Software


Malte Doerper, senior manager of product management at Synopsys, talks about the big "shift left" for software, where the problems crop up, and how to save as much as a year of development time with automation and better methodologies.   Related Stories Bridging Hardware And Software The need for concurrent hardware-software design and verification is increasing, but are engine... » read more

Tech Talk: ADAS


Kurt Shuler, vice president of marketing at Arteris, explains what the Advanced Driver Assistance Systems standard is, where the problems are, and why this is becoming so important in automotive semiconductor design. » read more

Tech Talk: 2.5D Issues


Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years. » read more

Tech Talk: ISO 26262


Arteris' Kurt Shuler talks about the automotive design standard, how it applies to semiconductors, and where engineers run into problems. » read more

Tech Talk: SoC Protocol Debug


Bernie DeLay, group director for verification IP R&D at Synopsys, talks about what goes wrong in complex SoCs, how so-called standard pieces play together, and where are the gotchas in re-use. [youtube vid=AaY_AmdjUpo] » read more

Tech Talk: USB Type-C


NXP's Ravi Shah explains how to design in the new USB standard, what to watch out for and why it's going to be so important for mobile and connected devices. [youtube vid=iPCwpaPy1pw] » read more

Tech Talk: Power Tools


At 200 million gates, using standard tools for power will add weeks to the semiconductor design process. Vijay Chobisa, product marketing manager at Mentor Graphics, talks with Semiconductor Engineering about where the problems are and how to solve them. [youtube vid=w7yEdtaIb9A] » read more

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