A compelling new business model for the Internet of Things, made possible by readily available production capacity, low-cost tools and lower-priced masks.
Current market and technology trends have increased the demand for mixed-signal ASICs. Smaller projects with modest design budgets are viable due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools, like Tanner EDA HiPer Silicon for developing mixed-signal ASICs.
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