The value proposition behind HBM and which companies are behind it.
High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology.
This white paper explains HBM’s value proposition, and how these five companies make it easy for system and integrated circuit (IC) designers to access the many benefits this technology offers. To read more, click here.