Part 8: Risks and the future.
In this eighth and final part of this series, we take a look at the risk that changes bring to quality control and test, and we discuss the potential effects on the future of moving to Industry 4.0.
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How this new memory stacks up against existing non-volatile memory.
Why it’s taking longer to manufacture chips at 10/7nm and what can be done about it.
So far there is not widespread adoption, but many see change as inevitable.
Internet of Things technology will be crucial to automobiles, but connectivity comes at a price.
What’s driving it, what’s next, and who should be concerned?
Using light to move large quantities of data looks promising, but gaps remain and the adoption timeline will vary by application.
Political uncertainty, tempered optimism, continued consolidation, and concerns about capacity.
Updated: Deal adds mechanical, thermal, electrical and embedded software capabilities.
As the industry speculates about 5nm and below, questions surrounding node shrinks remain.
When it comes to multi-board and multi-chips-on-a-board designs, do engineers have all the tools they need?
Adding more features and more power states is making it harder to design chips at 10nm and 7nm.