Knowledge Center

Knowledge Center ➜ Entity
eSilicon Corporation
ASIC, SoC and 2.5D design and manufacturing services


eSilicon is an independent provider of finFET-class ASIC design, custom IP and advanced 2.5D packaging solutions. The company develops 2.5D/HBM2 and TCAM platforms for finFET technology at 16/14nm. It focuses on multiple markets, including high-bandwidth networking, high-performance computing, artificial intelligence and the 5G infrastructure markets.

Executive Insight: Jack Harding
eSilicon’s president and CEO talks about the rising cost of semiconductor development and what will change for the companies that no longer can afford to pay those costs.




We want to hear from you. If you have any comments or suggestions about this page, please send us your feedback.