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eSilicon Corporation
ASIC, SoC and 2.5D design and manufacturing services
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Description:

eSilicon is an independent provider of finFET-class ASIC design, custom IP and advanced 2.5D packaging solutions. The company develops 2.5D/HBM2 and TCAM platforms for finFET technology at 16/14nm. It focuses on multiple markets, including high-bandwidth networking, high-performance computing, artificial intelligence and the 5G infrastructure markets.

Executive Insight: Jack Harding
eSilicon’s president and CEO talks about the rising cost of semiconductor development and what will change for the companies that no longer can afford to pay those costs.


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