The Power Of De-Integration


The idea that more functionality can be added into a single chip, or even into a single system, is falling out of vogue. For an increasing number of applications, it's no longer considered the best option for boosting performance or lowering power, and it costs too much. Hooman Moshar, vice president of engineering at Broadcom, said in a keynote speech at Mentor's User2User conference this w... » read more

Chipmakers Look Beyond Scaling


Gary Patton, CTO of GlobalFoundries, sat down with Semiconductor Engineering to discuss the rollout of EUV, the rising cost of designing chips at the most advanced nodes, and the growing popularity of 22nm planar FD-SOI in a number of markets. What follows are excerpts of that conversation. SE: You've just begun deploying EUV. Are you experiencing any issues? Patton: It's a very complicat... » read more

A New Memory Contender?


Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

Foundry Challenges in 2018


The silicon foundry business is expected to see steady growth in 2018, but that growth will come with several challenges. On the leading edge, GlobalFoundries, Intel, Samsung and TSMC are migrating from the 16nm/14nm to the 10nm/7nm logic nodes. Intel already has encountered some difficulties, as the chip giant recently pushed out the volume ramp of its new 10nm process from the second half ... » read more

Body Biasing For Analog Design


This paper presents the practical application of body biasing control of ultra-deep submicron FD-SOI technologies for analog and mixed-signal designs. The body biasing control is dedicated for dynamic control of the trade- off between speed vs. power consumption for advanced digital circuits. However, in this work we focus on trading-off and improvement of analog circuit performances. Three dif... » read more

Inside FD-SOI And Scaling


Gary Patton, chief technology officer at [getentity id="22819" comment="GlobalFoundries"], sat down with Semiconductor Engineering to discuss FD-SOI, IC scaling, process technology and other topics. What follows are excerpts of that conversation. SE: In logic, GlobalFoundries is shipping 14nm finFETs with 7nm in the works. The company is also readying 22nm FD-SOI technology with 12nm FD-SOI ... » read more

22nm Process War Begins


Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

Tech Talk: Embedded Memories


Dave Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of new types of embedded memory, including which work best for certain applications and with various advanced packaging options. [youtube vid=7D9zoA9FFIw] » read more

7nm Market Heats Up


The 7nm finFET market is heating up in the foundry business amid the ongoing push to develop chips at advanced nodes. Not long ago, TSMC announced plans to enter the 7nm finFET market. In addition, Intel and Samsung are also separately planning to enter the 7nm finFET race. Now, GlobalFoundries is formally announcing its 7nm finFET technology. Slated for 2018, GlobalFoundries’ 7nm fin... » read more

GlobalFoundries Rolls Out 12nm FD-SOI Process


GlobalFoundries uncorked its 12FDX platform, incorporating a 12nm fully-depleted silicon-on-insulator process technology. The foundry’s Fab 1 in Dresden, Germany, will support customer development with the 12nm process, with product tape-outs scheduled for the first six months of 2019. The 12FDX technology follows the company’s 22FDX platform involving a 22-nanometer process. The foundr... » read more

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