Applying Machine Learning To Chips

The race is on to figure out how to apply analytics, data mining and machine learning across a wide swath of market segments and applications, and nowhere is this more evident than in semiconductor design and manufacturing. The key with ML/DL/AI is understanding how devices react to real events and stimuli, and how future devices can be optimized. That requires sifting through an expandi... » read more

EUV’s New Problem Areas

Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

DSA Re-Enters Litho Picture

By Mark LaPedus and Ed Sperling Directed self-assembly (DSA) is moving back onto the patterning radar screen amid ongoing challenges in lithography. Intel continues to have a keen interest in [gettech id="31046" t_name="DSA"], while other chipmakers are taking another hard look at the technology, according to multiple industry sources. DSA isn't like a traditional [getkc id="80" kc_name="... » read more

More Lithography/Mask Challenges

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Regina Freed, managing director of patterning technology at [getentity id="... » read more

Why All Nodes Won’t Work

A flood of new nodes, half-nodes and every number in between is creating confusion among chipmakers. While most say it's good to have choices, it's not clear which or how many of those choices are actually good. At issue is which [getkc id="43" kc_name="IP"] will be available for those nodes, how that IP will differ from other nodes in terms of power, performance, area and sensitivity to a v... » read more

By the Power Vested in Me, I Now Pronounce You (The SoC Designer)…

…Doomed. Well, maybe that’s a little harsh, but your job won’t be getting any easier; that “happily ever after” may be harder to achieve than you think, and there are a number of reasons why. And by “me” (of vested power), here I’m really talking about the power of the consumer market as a whole and our collective insatiable demand for newer, shinier…well, just plain “coo... » read more

Tech Talk: On-Chip Variation

Raymond Nijssen, vice president of systems engineering at Achronix, discusses on-chip and process variation at 7nm and 5nm, the role of embedded FPGAs, and how to reduce margin and pessimistic designs. » read more

Executive Insight: Wally Rhines

Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to discuss a wide range of industry and technology changes and how that will play out over the next few years. What follows are excerpts of that conversation. SE: What will happen in the end markets? Rhines: The end markets are perhaps more exciting from a... » read more

Chip Aging Accelerates

Reliability is becoming an increasingly important proof point for new chips as they are rolled out in new markets such as automotive, cloud computing and industrial IoT, but actually proving that a chip will function as expected over time is becoming much more difficult. In the past, reliability generally was considered a foundry issue. Chips developed for computers and phones were designed ... » read more

New Thermal Issues Emerge

Thermal monitoring is becoming more critical as gate density continues to increase at each new node and as chips are developed for safety critical markets such as automotive. This may sound counterintuitive because the whole point of device scaling is to increase gate density. But at 10/7 and 7/5nm, static current leakage is becoming a bigger issue, raising questions about how long [getkc id... » read more

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