By Mark LaPedus
Semiconductor Manufacturing & Design sat down to discuss 3D device challenges and applications with John Lau, a fellow at the Industrial Technology Research Institute (ITRI), a research organization in Taiwan.
SMD: What is ITRI doing in 3D TSVs?
Lau: At ITRI we have developed the world’s first Applied Materials’ 300mm (3D TSV) integration line. The line was comple... » read more