The Week In Review: Manufacturing

Samsung plans to make a major entry into the drone market, according to reports. “Samsung is not alone in focusing on the drone market,” said Will Strauss, president of Forward Concepts, in a research note. “At CES next month in Las Vegas, one can expect new products from drone market leader DJI, but dozens of new drone models from Parrot and many other companies. Even GoPro chip maker A... » read more

Executive Insight: Lip-Bu Tan

Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to talk about consolidation, Moore's Law, and where the opportunities are in the IoT and automotive markets. What follows are excerpts of that conversation. SE: What are the big concerns for the semiconductor industry in general, and EDA in particular? Tan: Top on my list is all the consolidation that's goin... » read more

The Week In Review: Manufacturing

NuFlare Technology wants to enter a new market. The e-beam giant and NGR are jointly collaborating on a development program for next-generation electron-beam wafer inspection and metrology. It’s unclear if NuFlare is developing a single- or multi-beam tool, however. Don’t look now, but a fab tool downturn could be on the horizon. This comes amid a slowdown in PCs, tablets and smartphone... » read more

The Week In Review: Manufacturing

GlobalFoundries completed its acquisition of IBM’s Microelectronics Group, creating a behemoth that is expected to extend well beyond the combined footprint of the existing companies. As part of the deal, GlobalFoundries will get two additional fabs, one of which makes RF SOI chips. But while IBM was hesitant to expand that business by adding new fab capacity, GlobalFoundries already has t... » read more

Foundries Expand Planar Efforts

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

Verification 2.0: From Tool To Flow

Recently, Cadence held a System-to-Silicon Verification Summit at which companies like Broadcom, Zenverge, NVIDIA, and Ambarella shared their experiences and visions for verification. In one of the keynotes, Brian Bailey shared his vision of how verification would transition from tools to flows. Brian’s presentation was quite insightful. He started with a brief status of where we are curre... » read more