Electromigration: Not Just Copper Anymore

While integrated circuit manufacturers have worried about electromigration for a long time, until recently most of their concerns have focused on the on-chip interconnects. The larger dimensions found in integrated circuit packages have, in most cases, improved heat dissipation, reduced current density, and eliminated most [getkc id="160" kc_name="electromigration"] risks. Over the last sev... » read more

High-Bandwidth Memory

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology. This white paper explains HBM’s value proposition, and how these five companies make... » read more