Money Pours Into New Fabs And Facilities

By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Chip Industry’s Technical Paper Roundup: Mar. 6

By Linda Christensen - 06 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=84 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Asynchronously Parallel Optimization Method For Sizing Analog Transistors Using Deep Neural Network Learning

By Technical Paper Link - 03 Mar, 2023 - Comments: 0

A new technical paper titled "APOSTLE: Asynchronously Parallel Optimization for Sizing Analog Transistors Using DNN Learning" was published by researchers at UT Austin and Analog Devices. Abstract "Analog circuit sizing is a high-cost process in terms of the manual effort invested and the computation time spent. With rapidly developing technology and high market demand, bringing automated s... » read more

Week In Review: Design, Low Power

By Jesse Allen - 03 Mar, 2023 - Comments: 0

Apple plans to spend an additional €1 billion (~$1.1B) over the next six years to expand its Munich, Germany-based Silicon Design Centre, including the construction of a new research facility. "The expansion of our European Silicon Design Centre will enable an even closer collaboration between our more than 2,000 engineers in Bavaria working on breakthrough innovations, including custom sil... » read more

Chip Industry’s Technical Paper Roundup: Oct. 4

By Linda Christensen - 04 Oct, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=55 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Functional Safety Verification Of Serial Peripheral Interface

By Technical Paper Link - 03 Oct, 2022 - Comments: 0

A new technical paper titled "FMEDA based Fault Injection to Validate Safety Architecture of SPI" was published by researchers at R.V. College of Engineering in India and Analog Devices. Abstract "The integration of advanced technologies into Electrical Vehicles (EV) has been increasing in recent times, so it has become crucial to evaluate the risk of the technologies that are deployed into... » read more

Week In Review: Manufacturing, Test

By Karen Heyman - 23 Sep, 2022 - Comments: 0

On Sunday, a 6.8-magnitude earthquake struck the southeast region of Taiwan, causing devastation. TSMC officials reported “no known significant impact for now.” Market research firm TrendForce arrived at a similar conclusion based on its analysis of individual fabs. The Biden administration announced appointment of the leadership team charged with implementing the US CHIPS and Science Ac... » read more

Week in Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 08 Jul, 2022 - Comments: 0

Automotive The European Union plans to approve sales of fully autonomous vehicles by the end of September, according to Politico. The legislative package will allow for the registration and sale of up to 1,500 vehicles per model per year in member countries. Level 4 autonomous vehicles are still in the development stage, but reducing human error in autos is a crucial part of the EU’s goal to... » read more

Week In Review: Design, Low Power

By Jesse Allen - 27 May, 2022 - Comments: 0

EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Manufacturing, Test

By Linda Christensen - 20 May, 2022 - Comments: 0

GlobalFoundries launched GF Labs, an “open framework of internal and external research and development initiatives that deliver a differentiated pipeline of market-driven process technology solutions for future data-centric, connected, intelligent and secure applications.” Greg Bartlett, GF's senior vice president of technology, engineering at quality, said the goal is to develop and exp... » read more

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tag: Analog Devices

Money Pours Into New Fabs And Facilities

Chip Industry’s Technical Paper Roundup: Mar. 6

Asynchronously Parallel Optimization Method For Sizing Analog Transistors Using Deep Neural Network Learning

Week In Review: Design, Low Power

Chip Industry’s Technical Paper Roundup: Oct. 4

Functional Safety Verification Of Serial Peripheral Interface

Week In Review: Manufacturing, Test

Week in Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week In Review: Manufacturing, Test

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