OLEDs Shine In Phones, TVs, Lights

OLEDs are coming—everywhere. While the new iPhone 7 models do not have organic light-emitting diode (OLED) displays, those handsets are likely to be the last Apple will offer before it makes the smartphone transition to OLED displays next year. The Apple Watch, however, does have a flexible OLED display with a sapphire crystal cover or an Ion-X glass cover, and the Apple Watch Series 2 ... » read more

The Week In Review: Manufacturing

Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

The Looming AI War

A recent spate of acquisitions and announcements in AI and machine learning is setting the stage for a colossal showdown across the tech industry. Among those vying for top spots are Samsung, Google, Apple, Microsoft and Amazon, each with a large enough revenue stream to support an M&A feeding frenzy and the sustained investments required to remain competitive. Consider the most recent a... » read more

The Week In Review: Manufacturing

Chipmakers In 2016, growth in the pure-play foundry business will be driven by leading-edge processes, according to IC Insights. In fact, the increase in pure-play foundry sales this year is forecast to be almost entirely due to processes at » read more

Smartphone Security: For Your Eyes Only

Fans of the Olympics here in the United States were treated to a great Samsung commercial throughout the broadcast. The commercial stars the genius, multi-award-winning actor Christoph Waltz, showing how Americans can multitask with the amazing new Galaxy Note7. Yes, THAT Galaxy Note7. The 90-second long commercial is a delight to watch, but it must have cost Samsung some serious bucks to produ... » read more

Packaging Wars Begin

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

The Week In Review: Manufacturing

Chipmakers The finFET market is heating up. GlobalFoundries, Intel, Samsung and TSMC are ramping 16nm/14nm finFETs. And 10nm and 7nm finFETs are in the works. The market will shortly have a new competitor—Taiwan’s United Microelectronics Corp. (UMC). Some years ago, UMC licensed finFET technology from IBM. UMC has been a bit quiet about the 14nm finFET technology, but it has made si... » read more

The Real Value Of Digital Horsepower

Chipmakers and systems vendors are beginning to experiment with a slew of new ways to beef up performance and reduce power and area, now that shrinking features no longer guarantees those improvements. The number of new ideas introduced at industry conferences in the past few months is almost mind-boggling. Just on the CPU side there are new architectures that improve the amount of work that... » read more

Auto Security And Technology Questions Persist

While carmakers continue to add increasingly sophisticated driver assist features to new models, semiconductor industry ecosystem players are ramping up their foundation knowledge of what is needed from a technology and security perspective. Fortunately, it appears many existing semiconductor design tools will fit the bill as part of new approaches for automotive design. Mike Stellfox... » read more

Stepping Back From Scaling

Architectures, packaging and software are becoming core areas for semiconductor research and development, setting the stage for a series of shifts that will impact a large swath of the semiconductor industry. While there is still demand from the largest chipmakers for increased density at the next process node, the underlying economics for foundries, equipment vendors and IP developers are f... » read more

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