Toward A 5G, AI-Centric World


The market environment over the coming years will continue to experience an explosion of data generation from a variety of new sources such as smart cars, smart factories, smart hospitals and smart network infrastructure. Data explosion combined with artificial intelligence (AI) will create a renaissance of computing and storage hardware. Mobile World Congress 2018 (MWC) reinforced this market ... » read more

New Patterning Options Emerging


Several fab tool vendors are rolling out the next wave of self-aligned patterning technologies amid the shift toward new devices at 10/7nm and beyond. Applied Materials, Lam Research and TEL are developing self-aligned technologies based on a variety of new approaches. The latest approach involves self-aligned patterning techniques with multi-color material schemes, which are designed for us... » read more

Searching For EUV Defects


Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this oft-delayed technology can be used in production. One lingering issue that is becoming more worrisome is how to find defects caused by [gettech id="31045" comment="EUV"] processes. These processes can cause random variations, also known as stochastic effects... » read more

More Lithography/Mask Challenges


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Regina Freed, managing director of patterning technology at [getentity id="... » read more

Blog Review: Apr. 11


Mentor's Dennis Brophy looks at how the black box nature of IP means it's hard to tell if a block is free from security risks, even if verification IP and open-source design code can help. Synopsys' Sri Deepti Pisipati explains Panel Self Refresh, a power saving mechanism in Display Port that allows for turning off the video processor and its circuitry when an image is static. Cadence's P... » read more

The Week In Review: Manufacturing


Trade wars China and the United States are in the midst of a trade war. Click here for the latest from CNN. Meanwhile, click here for a list of the winners and losers so far. Display Supply Chain Consultants, a research firm, provides more insights from a hi-tech perspective. Gary Shapiro, president and CEO of the U.S.-based Consumer Technology Association (CTA), issued a statement abo... » read more

TEL Sells Packaging Tool Unit


Tokyo Electron Ltd. (TEL) has signed a definitive agreement to sell its packaging equipment unit, TEL NEXX, to ASM Pacific Technology. With the proposed deal, ASM Pacific enters some new markets. ASM Pacific sells wire bonders, pick-and-place systems, leadframes and other products. Established in 2001, TEL NEXX sells electrochemical deposition (ECD) and physical vapor deposition (PVD) s... » read more

The Week In Review: Manufacturing


Trade President Trump this week announced his decisions on the actions the administration will take in response to China’s alleged unfair trade practices covered in the USTR Section 301 investigation of “China’s Acts, Policies, and Practices Related to Technology Transfer, Intellectual Property, and Innovation.” Trump has proposed import tariffs that amount to about $60 billion on pro... » read more

The Bumpy Road To 5G


5G is coming, but not everywhere, not all at once, and not the fastest version of this technology right away. In fact, the probable scenario is that 5G will be rolled out first in densely populated urban areas, starting in 2020 or 2021, with increasingly widespread adoption over the next decade after that. But 5G is unlikely to ever completely replace 4G LTE, just as a smart phone today roll... » read more

EUV’s New Problem Areas


Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

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