tag: Arteris

Commercial Chiplet Ecosystem May Be A Decade Away
By Ann Mutschler - 29 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the challenges of establishing a commercial chiplet ecosystem with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA product mana... » read more

Accellera Preps New Standard For Clock-Domain Crossing
By Brian Bailey - 29 Feb, 2024 - Comments: 0

Part of the hierarchical development flow is about to get a lot simpler, thanks to a new standard being created by Accellera. What is less clear is how long will it take before users see any benefit. At the register transfer level (RTL), when a data signal passes between two flip flops, it initially is assumed that clocks are perfect. After clock-tree synthesis and place-and-route are perfor... » read more

NoC Development – Make Or Buy?
By Frank Schirrmeister - 29 Feb, 2024 - Comments: 0

In the selection and qualification process for semiconductor IP, design teams often consider the cost of in-house development. Network-on-Chip (NoC) IP is no different. In “When Does My SoC Design Need A NoC?” Michael Frank and I argued that most of today’s designs – even less complex ones – can benefit from NoCs. In the blog “Balancing Memory And Coherence: Navigating Modern Chip A... » read more

Integration Challenges For RISC-V Designs
By Ed Sperling - 27 Feb, 2024 - Comments: 0

One of the big draws of RISC-V is that it allows design teams to create unique chips or chiplets and to make modifications to the instruction-set architecture. That extra degree of freedom also creates some issues when it comes to integrating those designs into packages or systems because they may require non-standard connectivity approaches. Frank Schirrmeister, vice president of marketing at ... » read more

Why Chiplets Are So Critical In Automotive
By John Koon - 20 Feb, 2024 - Comments: 1

Chiplets are gaining renewed attention in the automotive market, where increasing electrification and intense competition are forcing companies to accelerate their design and production schedules. Electrification has lit a fire under some of the biggest and best-known carmakers, which are struggling to remain competitive in the face of very short market windows and constantly changing requir... » read more

Chip Industry Week In Review
By The SE Staff - 16 Feb, 2024 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

Re-architecting Hardware For Energy
By Brian Bailey - 15 Feb, 2024 - Comments: 0

A lot of effort has gone into the power optimization of a system based on the RTL created, but that represents a small fraction of the possible power and energy that could be saved. The industry's desire to move to denser systems is being constrained by heat, so there is an increasing focus on re-architecting systems to reduce the energy consumed per useful function performed. Making signifi... » read more

Memory’s Future Hinges On Reliability
By Karen Heyman - 14 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of power and heat on off-chip memory, and what can be done to optimize performance, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; a... » read more

Chip Industry Week In Review
By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

EDA Back On Investors’ Radar
By Brian Bailey - 25 Jan, 2024 - Comments: 0

EDA is transforming from a staid but strategic sector into a hot investment market, fueled by strong earnings and growth, a clamoring for leading-edge and increasingly customized designs across new and existing markets, and the rollout of advanced technologies such as AI for a range of tools that will be needed to develop new architectures with much greater performance per watt. A confluence... » read more

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