Deconstructing Deep Learning


I discuss AI and deep learning a lot these days. The discussion usually comes back to “what is a deep learning chip?” These devices are basically hardware implementations of neural networks. While neural nets have been around for a while, what’s new is the performance advanced semiconductor technology brings to the party. Applications that function in real time are now possible. But wh... » read more

eSilicon Builds ASIC Business On Leading-Edge Chip Design


How advanced application specific integrated circuits (ASIC) chip design and manufacturing for leading-edge applications such as networking and artificial intelligence can be successfully outsourced. The company which has capabilities in 2.5D packaging, high-bandwidth memories (HBM), and silicon IP for fast memories and SerDes designs. The company has many leading system companies as custome... » read more

In Case You Missed It


We recently held two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic p... » read more

The Future Of AI Is In Materials


I had the pleasure of hosting an eye-opening presentation and Q&A with Dr. Jeff Welser of IBM at a recent Applied Materials technical event in San Francisco. Dr. Welser is Vice President and Director of IBM Research's Almaden lab in San Jose. He made the case that the future of hardware is AI. At Applied Materials we believe that advanced materials engineering holds the keys to unlocking... » read more

Preparing For Bigger Changes Ahead


The semiconductor industry has undergone a fundamental shift over the past year, and it's one that will redefine chipmaking over the next decade or more. While the focus is still on building the fastest, lowest-power devices, whether that's by shrinking features or packaging them into blazing-fast 2.5D or fan-out configurations, these devices are being customized for specific use cases much ... » read more

What’s Next?


We just concluded two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic ... » read more

Lowering The Barriers To Entry For ASICs


The future of IoT and its rate of scalability depends upon increased functionality in the smallest form factors. Arm knows that OEMs are increasingly turning to custom SoCs/ASICs for a wealth of benefits: differentiation, cost savings, improved reliability, and smaller products. So, at Arm, we wanted to better understand the perceived risks involved for OEMs – what makes custom SoCs a task... » read more

Automotive Foundries


The race to win a piece of the automotive electronics business has now reached the foundry level, and right now it's not clear exactly how this is going to work. This is uncharted territory for everyone. The build-out of electronics for assisted and autonomous driving is brand new. For existing cars, most of the chips being used are off-the-shelf microcontrollers, commodity MEMS sensors, and... » read more

Where MEMS Can Boldly Go Now


MEMS chips are being designed to go into the human body as biosensors, which will require unique packaging. And as demand grows for assisted and automated driving, MEMS devices also are finding new use cases in automotive electronics, their chief market segment prior to the millennium. Pressure sensors, such as those that monitor the air pressure in tires, remain the biggest type of [getkc i... » read more

eFPGA Acceleration in SoCs


The Speedcore design and integration methodology has been defined with intimate awareness of the difficulties ASIC engineering teams must contend with. All the necessary files and flows for capturing the functional, timing and power characteristics of a user-defined and programmed Speedcore instance, along with support for successfully reconfiguring an already field-deployed Speedcore IP embedd... » read more

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