Stacked Die Changes


Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. ... » read more

What’s After Smartphones?


One of the unique things about the semiconductor industry is that it has fueled the digital revolution almost entirely by focusing on its core competencies of performance, power and area. There are few, if any, industries that can tie global growth and success to what amounts to an almost isolationist business model. Salespeople have to sell those chips, of course. Marketers have to create ... » read more

Semicon West Preview: Packaging


By Paula Doe The evolving mobile device market means the packaging, assembly and test supply chain faces a growing range of alternative technologies vying for its investment dollar, everything from Google’s modular electronics with 3D printing, to more solutions for integrating varied chips in smaller packaged systems. One potentially disruptive change is the wider use of more open-source... » read more