Time For Massively Parallel Testing


Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

Looking Back at Board Test


Printed circuit board testing has been around as long as printed circuit boards, also known as printed circuit assemblies and printed wiring boards. PCB technology started in the early 20th century with Thomas Edison and other inventors. As boards shrink to fit inside wearable gadgets and other products with compact form factors, PCB test equipment vendors are addressing new challenges. Boar... » read more

System-Level Testing


This white paper on system-level testing for semiconductors. Covering the history and trends of system-level test for semiconductors, this solution brief discusses: The increasing complexities of testing advanced semiconductor integrated devices across a span of applications: automotive, mobile computing, wearables, and more; Semiconductor trends driving necessary shifts in testing method... » read more

2.5D, FO-WLP Issues Come Into Focus


Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

The Week In Review: Manufacturing


Fab tools In response to SEMI members and partners, SEMI says it is not organizing Semicon Russia 2017, or any other events in Russia this year. “In light of the current market conditions and SEMI stakeholder concerns, SEMI reached out to members and customers over the last six months to assess how to provide the most value for our community in Russia,” said Laith Altimime, president of SE... » read more

The Week In Review: Manufacturing


Chipmakers The finFET market is heating up. GlobalFoundries, Intel, Samsung and TSMC are ramping 16nm/14nm finFETs. And 10nm and 7nm finFETs are in the works. The market will shortly have a new competitor—Taiwan’s United Microelectronics Corp. (UMC). Some years ago, UMC licensed finFET technology from IBM. UMC has been a bit quiet about the 14nm finFET technology, but it has made si... » read more