MEMS Market Shifting


The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this points to higher selling prices, which are long overdue in this space. For years, the market for microelectromechanical systems was populated by too many companies vying for too few opportunit... » read more

Targeting And Tailoring eFPGAs


Robert Blake, president and CEO of Achronix, sat down with Semiconductor Engineering to discuss what's changing in the embedded FPGA world, why new levels of customization are so important, and difficulty levels for implementing embedded programmability. What follows are excerpts of that discussion. SE: There are numerous ways you can go about creating a chip these days, but many of the prot... » read more

Improving Automotive Reliability


Semiconductor reliability requirements are rapidly evolving. New applications such as ADAS/self-driving cars and drones are pushing the limits for system reliability. A mobile phone that overheats in your pocket is annoying. In automobiles, it's a much different story. Overheating can impact the operation of backup sensors, which alert the driver that a pedestrian or obstacle is behind them.... » read more

Improving Yield, Reliability With Data


Big data techniques for sorting through massive amounts of data to identify aberrations are beginning to find a home in semiconductor manufacturing, fueled by new requirements in safety-critical markets such as automotive as well as the rising price of packaged chips in smartphones. Outlier detection—the process of finding data points outside the normal distribution—isn't a new idea. It ... » read more

Reliability Of eWLB For Automotive Radar Applications


With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as Ball Grid Array (BGA) with flipchip or wirebonding. With the advancement of various fan-out (FO) WLPs, it has been proven to be a more optimal, low cost, integrated and reliable solution compared to ... » read more

The Future Of Human/Machine Interaction Is Personal


What comes to mind when you think of a human/machine interface? Something close at hand like your smartphone’s GPS and the ATMs at your bank? Something futuristic like flying cars and jetpacks? Something dangerous like menacing cyborgs? As technology becomes more pervasive in our everyday activities, there are a growing number of human/machine interfaces. They also are becoming more personal.... » read more

Advanced Packaging’s Progress


Shim Il Kwon, CTO at STATS ChipPAC, sat down with Semiconductor Engineering to discuss the current and future trends of chip packaging. What follows are excerpts of that conversation. SE: The outsourced semiconductor assembly and test (OSAT) vendors provide third-party IC-packaging and test services. What are the big challenges for OSATs today? Shim: The OSAT market is very competitive, w... » read more

Get Ready For The Uber-Like Economy


The shift to autonomous cars will have far-reaching effects that go well beyond the loss of a steering wheel. In fact, it could completely shake up the automotive ecosystem and broad swaths of the economy that were largely built around and in cars. Carmakers are now trying squeeze every penny out of the cost of electronics for assisted and ultimately autonomous vehicles to get that price som... » read more

Functional Safety Issues Rising


Developing semiconductors for safety-critical markets such as automotive, industrial and medical involves a growing list of extra steps that need to be taken pre- and post-manufacturing to ensure product integrity, reliability and security. This is causing several significant changes: • Designs are becoming much more complicated because they require such features as failover and redundan... » read more

Achieving ISO 26262 Certification With ASIL-Ready IP


According to an article by McKinsey, “analysts predict revenue growth for advanced driver assistance systems (ADAS) to be up to 29 percent, giving the segment one of the highest growth rates in the automotive and related industries.” This opportunity has invigorated the automotive supply chain to increase their R&D investments for faster product innovations. The focus on innovation is e... » read more

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