tag: bias temperature instability

NBTI & PBTI of MOSFETs
By Technical Paper Link - 30 May, 2022 - Comments: 0

Technical paper titled "Bias Temperature Instability of MOSFETs: Physical Processes, Models, and Prediction" from researchers at Liverpool John Moores University. Abstract "CMOS technology dominates the semiconductor industry, and the reliability of MOSFETs is a key issue. To optimize chip design, trade-offs between reliability, speed, power consumption, and cost must be carried out. This r... » read more

What’s Holding Back Aging Simulation?
By Andre Lange - 09 Apr, 2020 - Comments: 0

Aging simulation supplies information about the long-term behavior before an IC enters into production, providing an important early evaluation of the reliability required by the application and specification. Re-designs due to reliability issues, and over-design with excessive safety margins, are avoided in this way. In addition, the long-term stability can be demonstrated to the customer. ... » read more

Toward Consistent Circuit-Level Aging Simulations In Different EDA Environments
By Fraunhofer IIS/EAS - 10 Apr, 2019 - Comments: 0

Aging simulations on circuit level allow integrated circuit (IC) designers to verify their circuits with respect to lifetime reliability requirements by considering the degradation of field effect transistors (FETs). To obtain significant analysis results with a reasonable effort, two prerequisites have to be fulfilled. First, reasonable models for FET degradation effects have to be set up. Sec... » read more

Aging Models: The Basis For Predicting Circuit Reliability
By Andre Lange - 12 Apr, 2018 - Comments: 0

Today, many products are based on high-performance electronic systems and integrated circuits (ICs), and the importance of these elements is ever-increasing. A certain tension arises here as these applications often call for a large amount of processing power and reliability. The processing power can best be supplied with highly scaled semiconductor technologies. However, these manufacturing te... » read more

Noise Abatement
By Brian Bailey - 12 Oct, 2017 - Comments: 0

[getkc id="285" kc_name="Noise"] is a fact of life. Almost everything we do creates noise as a by-product and quite often what is a signal to one party is noise to another. Noise cannot be eliminated. It must be managed. But is noise becoming a larger issue in chips as the technology nodes get smaller and packaging becomes more complex? For some, the answer is a very strong yes, while for ot... » read more

Will Self-Heating Stop FinFETs
By Katherine Derbyshire - 20 Apr, 2017 - Comments: 0

New transistor designs and new materials don’t appear out of thin air. Their adoption always is driven by the limitations of the incumbent technology. Silicon germanium and other compound semiconductors are interesting because they promise superior carrier mobility relative to silicon. [getkc id="185" kc_name="FinFET"] transistor designs help minimize short channel effects, a critical limi... » read more

Transistor-Level Verification Returns
By Brian Bailey - 13 Jan, 2016 - Comments: 1

A few decades ago, all designers did transistor-level verification, but they were quite happy to say goodbye to it when standard cells provided isolation at the gate-level and libraries provided all of the detailed information required, such as timing. A few dedicated people continued to use the technology to provide those models and libraries and the most aggressive designs that wanted to stri... » read more

The End Of Silicon?
By Katherine Derbyshire - 04 May, 2015 - Comments: 1

As transistors shrink, not all device parameters scale at the same rate—and therein lies a potentially huge problem. In recent years, manufacturers have been able to reduce equivalent oxide thickness (EOT) more quickly than operating voltage. As a result, the electric field present in the channel and gate dielectric has been increasing. Moreover, EOT reduction is achieved in part by reduci... » read more

Aging: Not Always A Bad Thing
By Ann Mutschler - 22 Aug, 2013 - Comments: 0

By Ann Steffora Mutschler When IC devices are produced and shipped to end customers, it is important that they will function as specified in the application environment. Determining how a device will operate over time is a key aspect of overall reliability and is commonly referred to as ‘aging.’ Aging of electronics is not a new problem. In fact, analog and automotive designers have bee... » read more

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