Manufacturing Bits: Sept. 6

DARPA ALD The University of Colorado at Boulder has developed an atomic layer deposition (ALD) technology that can be performed at room temperatures. The technology, dubbed electron-enhanced ALD (EE-ALD), has been developed as part of the Local Control of Materials Synthesis (LoCo) program at the U.S. Defense Advanced Research Projects Agency (DARPA). The LoCo program is developing tech... » read more

Flexible Sensors Begin Ramping

Sensors are at the heart of the [getkc id="76" comment="Internet of Things"]. Flexible sensors promise to extend the Internet of Everything to the battlefield, the gymnasium, the hospital, and many other places. Flexible [getkc id="187" kc_name="sensors"] represent the forefront of a sea of change in electronics, marking the transition from rigid semiconductors made with silicon and other ha... » read more

Manufacturing Bits: Jan. 5

New materials for 3D printing HRL Laboratories has developed a new ceramic technology for 3D printing. The technology overcomes the limits of traditional ceramic processing, thereby enabling high-strength components. Ceramics are much more difficult to process than traditional 3D printing materials, such as polymers or metals, according to HRL, a corporate R&D laboratory owned by The Boeing... » read more

Manufacturing Bits: Oct. 6

Magnetic mass spectrometers The National High Magnetic Field Laboratory (National MagLab) has developed a mass spectrometer, based on what the organization claims is the world’s highest field superconducting magnet. The instrument from National MagLab is called a Fourier transform ion cyclotron resonance (FT-ICR) mass spectrometer. The mass spectrometer boasts a 21 tesla magnet, which is ... » read more

Inside The System-Level Supply Chain

System-Level Design sat down to discuss supply chain issues with Bill Chown product marketing director for the system-level engineering division at Mentor Graphics and a longtime participant in a number of standards efforts across the semiconductor design industry. What follows are excerpts of that conversation. SLD: What’s happening with system engineering as chip design/manufacturing mo... » read more

Mixed-Signal Technology Summit Proceedings

On September 20 Cadence held the second Mixed-Signal Technology Summit. Experts from Cadence and other leading companies presented the latest mixed-signal design methodologies. If you missed the event, you can still view the material via the below archived proceedings. To view the presentations and videos, click here. » read more

Redefining Systems Around Power

By Ed Sperling Engineers have been talking about system-level power budgets since Moore’s Law reached 65nm, but as power becomes a critical element of any design with or without a plug the definition of what constitutes a system is changing. While most SoC engineers think of the system as an IC, power increasingly is playing a significant role in the subsystem, and even in the larger syst... » read more