Challenges Grow For IP Reuse


As chip complexity increases, so does the complexity of IP blocks being developed for those designs. That is making it much more difficult to re-use IP from one design to the next, or even to integrate new IP into an SoC. What is changing is the perception that standard [getkc id="43" kc_name="IP"] works the same in every design. Moreover, well-developed [getkc id="100" kc_name="methodologie... » read more

Worst-Case Results Causing Problems


The ability of design tools to identify worst-case scenarios has allowed many chipmakers to flag potential issues well ahead of tapeout, but as process geometries shrink that approach is beginning to create its own set of issues. This is particularly true at 16/14nm and below, where extra circuitry can slow performance, boost the amount of power required to drive signals over longer, thinne... » read more

What Can Be Cut From A Design?


A long-standing approach of throwing everything into a chip increasingly is being replaced by a focus on what can be left out it. This shift is happening at every level, from the initial design to implementation. After years of trying to fill every square nanometer of real estate on a piece of silicon with memory and logic, doubling the number of [getkc id="26" kc_name="transistors"] from on... » read more

The Week In Review: Manufacturing


Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

The Power And Limits Of Money


[getperson id="11694" p_name="Wally Rhines"], CEO of [getentity id="22017" e_name="Mentor Graphics"], sat down with Semiconductor Engineering to discuss how semiconductor engineering teams make their dollars work even when budgets are limited. The issue is as important as ever, given the industry's unrelenting margin and cost pressure and the growing competition for top talent. What follows are... » read more

Looking Back On IoT In 2016


The Internet of Things was going great guns for most of 2016. Until October 21, that is. That’s the date of the coordinated cyberattacks on Dyn, an Internet performance management services firm. The distributed denial-of-service attacks quickly had impacts on Airbnb, Amazon, Facebook, Netflix, PayPal, Reddit, Twitter, and other popular websites. Dyn was able to fight off the aggressive att... » read more

CEO Outlook: Chip Design 2017


After two consecutive flat to slightly down years, the semiconductor industry is poised for growth in 2017. Cowan this month predicted 4.7% growth in semiconductor sales in 2017, while World Semiconductor Trade Statistics (WSTS) put that figure at 3.3%. And last month, International Business Strategies (IBS) pegged the number at 4.6%, according to statistics compiled by the Global Semiconduc... » read more

Chip Advances Play Big Role In Cloud


Semiconductor engineering teams have been collaborating with key players in the data center ecosystem in recent years, resulting in unforeseen and substantial changes in how data centers are architected and built. That includes everything from which boxes, boards, cards and cables go where, to how much it costs to run them. The result is that bedrock communication technology and standards li... » read more

The Week In Review: IoT


Security Last month’s distributed denial-of-service cyberattacks have put the spotlight on poorly secured or insecure Internet of Things devices. "The harsh reality is that cybersecurity is not even on the radar of many manufacturers," said Trent Telford, CEO of Covata, an Internet security firm. "Security will eventually become more of a priority, but it may well be too late for this genera... » read more

The Week In Review: Manufacturing


Samsung Austin Semiconductor plans to invest more than $1 billion in its fab in Austin, Texas. Today, the fab continues to ramp up the company’s 14nm finFET technology. At the same time, Samsung is expanding its advanced finFET foundry process technology offerings with its fourth-generation 14nm process (14LPU) and its third-generation 10nm technology (10LPU). Graphcore is developing a so-... » read more

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