Design Rule Complexity Rising


Variation, edge placement error, and a variety of other issues at new process geometries are forcing chipmakers and EDA vendors to confront a growing volume of increasingly complex, and sometimes interconnected design rules to ensure chips are manufacturable. The number of rules has increased to the point where it's impossible to manually keep track of all of them, and that has led to new pr... » read more

Designing 5G Chips


5G is the wireless technology of the future, and it’s coming fast. The technology boasts very high-speed data transfer rates, much lower latency than 4G LTE, and the ability to handle significantly higher densities of devices per cell site. In short, it is the best technology for the massive amount of data that will be generated by sensors in cars, IoT devices, and a growing list of next-g... » read more

Blog Review: Apr. 18


Cadence's Meera Collier provides an overview of five emerging technologies that could drive the semiconductor industry in the future, from carbon nanotubes to quantum computing. Mentor's Colin Walls reminds embedded software developers of a few common sense tips, including better readability with braces in C/C++ and monitoring stack overflow. Synopsys' Tim Mackey rounds up the last few we... » read more

What Happened To UPF?


Two years ago there was a lot of excitement, both within the industry and the standards communities, about rapid advancements that were being made around low-power design, languages and methodologies. Since then, everything has gone quiet. What happened? At the time, it was reported that the [gettech id="31043" comment="IEEE 1801"] committee was the largest active committee within the IEEE. ... » read more

The Week In Review: Design


Tools & IP Cadence unveiled its latest DSP for embedded vision and AI, Tensilica Vision Q6 DSP. The DSP is built on a 13-stage processor pipeline and new system architecture designed for use with large local memories, and achieves 1.5GHz peak frequency and 1GHz typical frequency at 16nm. Compared to its predecessor, it offers 1.5X greater vision and AI performance than its predecessor and ... » read more

Processing Moves To The Edge


Edge computing is evolving from a relatively obscure concept into an increasingly complex component of a distributed computing architecture, in which processing is being shifted toward end devices and satellite data facilities and away from the cloud. Edge computing has gained attention in two main areas. One is the [getkc id="78" kc_name="industrial IoT"], where it serves as a do-it-yoursel... » read more

Scaling Up Vision And AI DSP Performance


Imagine these futuristic scenarios: you hold your phone up to your face, and it automatically recognizes you and unlocks, so you can access content. A sensor at your front door recognizes that you are not an intruder, no matter what the wind has done to your hair or whether your face is obscured by a scarf. How about an autonomous car that recognizes your driving style, so not only can you turn... » read more

High-Performance Memory Challenges


Designing memories for high-performance applications is becoming far more complex at 7/5nm. There are more factors to consider, more bottlenecks to contend with, and more tradeoffs required to solve them. One of the biggest challenges is the sheer volume of data that needs to be processed for AI, machine learning or deep learning, or even in classic data center server racks. “The design... » read more

Get Ready For Integrated Silicon Photonics


Long-haul communications and data centers are huge buyers of photonics components, and that is leading to rapid advances in the technology and opening new markets and opportunities. The industry has to adapt to meet the demands being placed on it and solve the bottlenecks in the design, development and fabrication of integrated [getkc id="41" kc_name="silicon photonics"]. "Look at the networ... » read more

Built-In Security For Auto Chips


The road to autonomous vehicles depends upon components that are secured against hacking and other outside interference. The cybersecurity precautions necessary for self-driving cars must be embedded in chips and systems from the beginning of the supply chain. Automotive manufacturers and their Tier 1 suppliers are counting on their electronics vendors to provide products that can withst... » read more

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