A Method to Measure Die Pad Capacitance


This paper defines a method to measure the chip die pad capacitance using time delay reflectometry (TDR). This method is useful for measuring the low-value capacitance that is present at the end of a transmission line. In all protocol specifications, pad capacitance is an important electrical parameter to be measured because it directly affects the bandwidth. However, it is a challenge to me... » read more

Electromagnetic Crosstalk Considerations In Low Power Designs


By Magdy Abadir, Padelis Papadopoulos, and Yehea Ismail
 Power consumption continues to be a critical design metric in high-performance mobile electronics. In order to meet the aggressive power budget targets, chips today need to operate at extremely low power levels, which increases the critical signals’ susceptibility to electromagnetic (EM) crosstalk effects. Because a low-power So... » read more

IP Electromagnetic Crosstalk Requires Contextual Signoff


By Magdy Abadir and Anand Raman Continuous advancement in technology scaling is enabling the emergence of high-performance application markets such as artificial intelligence, autonomous cars and 5G communication. These electronic systems operate at multi-GHz speed, while consuming the lowest amount of power possible leaving very little margin for error. Chips in these systems are highly in... » read more

Why Inductance Is Good for Area, Power and Performance


By Magdy Abadir and Yehea Ismail For chips designed at advanced technology nodes, interconnect is the dominant contributor towards delay, power consumption, and reliability. Major interconnects such as clock trees, power distribution networks and wide buses play a significant role in chip failure mechanisms such as jitter, noise coupling, power distribution droops, and electro-migration. ... » read more

Tech Talk: 5/3nm Parasitics


Ralph Iverson, principal R&D engineer at Synopsys, talks about parasitic extraction at 5/3nm and what to expect with new materials and gate structures such as gate-all-around FETs and vertical nanowire FETs. https://youtu.be/24C6byQBkuI » read more

Pushing Performance Limits


Trying to squeeze the last bit of performance out of a chip sounds like a good idea, but it increases risk and cost, extends development time, reduced yield, and it may even limit the environments in which the chip can operate. And yet, given the amount of margin added at every step of the development process, it seems obvious that plenty of improvements could be made. "Every design can be o... » read more

Managing Parasitics For Transistor Performance


The basic equations describing transistor behavior rely on parameters like channel doping, the capacitance of the gate oxide, and the resistance between the source and drain and the channel. And for most of the IC industry's history, these have been sufficient. “Parasitic” or “external” resistances and capacitances from structures outside the transistor have been small enough to discoun... » read more

BEOL Issues At 10nm And 7nm (part 2)


Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

7nm Power Issues And Solutions


Being able to achieve 35% speed improvement, 65% power reduction and 3.3X higher density makes adopting a 7nm process for your next system-on-chip (SoC) design seem like an easy decision. However, with $271 million in estimated total design cost and 500 man-years it would take to bring a mid-range 7nm SoC to production, companies need to carefully weigh the benefits against the cost of designin... » read more

Partitioning For Power


Examine any smartphone design today and most of the electronic circuitry is "off" most of the time. And regardless of how many processor cores are available, it's rare to use more than a couple of those cores at any point in time. The emphasis is shifting, though, as the mobility market flattens and other markets such as driver-assisted vehicles and IoT begin gaining traction. In a car, turn... » read more

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