Chip-Package-Board Optimization: The Future Of Integrated Co-Design


Multi-die and three-dimensional packages have made breakout and routing of extremely high-pin-count devices on PCBs very difficult. Keeping track of all the signals and pins is also a task that has just about outgrown current methods. Many companies simply use a spreadsheet for tracking signals. With no central database or accurate device modeling and rule-based optimization, design intent is o... » read more