Advanced Packaging Goes Mainstream


The roadmap for shrinking digital logic will continue for at least the next 10 years. For others devices, particularly analog, it will slow down or end. And therein lies one of the most fundamental changes in semiconductor design and manufacturing in the past half century. This is no longer just talk. Apple is using a fan-out architecture in its iPhone 7. Memory makers are stacking NAND and ... » read more

Moore’s Law: A Status Report


Moore's Law has been synonymous with "smaller, faster, cheaper" for the past 52 years, but increasingly it is viewed as just one of a number of options—some competing, some complementary—as the chip industry begins zeroing in on specific market needs. This does not make [getkc id="74" comment="Moore's Law"] any less relevant. The number of companies racing from 16/14nm to 7nm is higher t... » read more

AI Storm Brewing


AI is coming. Now what? The answer isn't clear, because after decades of research and development, AI is finally starting to become a force to reckon with. The proof is in the M&A activity underway right now. Big companies are willing to pay huge sums to get out in front of this shift. Here is a list of just some of the AI acquisitions announced or completed over the past few years: ... » read more

Custom Hardware Thriving


In the early days of the IoT, predictions about the commoditization of hardware and the end of customized hardware were everywhere. Several years later, those predictions are being proven wrong. Off-the-shelf components have not replaced customized hardware, and software has not dictated all designs. In fact, in many cases the exact opposite has happened. And where software does play an elev... » read more

The Week In Review: Manufacturing


Manufacturing Veeco Instruments has signed a definitive agreement to acquire Ultratech. With the deal, Veeco will enter into the lithography market for chip-packaging as well as the laser spike anneal business. Veeco is a supplier of MOCVD tools. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million. FlexTech, a SE... » read more

What’s Missing In Advanced Packaging


Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

Chip Advances Play Big Role In Cloud


Semiconductor engineering teams have been collaborating with key players in the data center ecosystem in recent years, resulting in unforeseen and substantial changes in how data centers are architected and built. That includes everything from which boxes, boards, cards and cables go where, to how much it costs to run them. The result is that bedrock communication technology and standards li... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Silicon Photonics Comes Into Focus


Silicon photonics is attracting growing attention and investment as a companion technology to copper wiring inside of data centers, raising new questions about what comes next and when. Light has always been the ultimate standard for speed. It requires less energy to move large quantities of data, generates less heat than electricity, and it can work equally well over long or short distances... » read more

Where Are The IoT Industry Standards?


Are you ready for some Internet of Things standards? Good, because you can help make them. The IoT is proceeding apace as a business, eagerly embraced by such corporate behemoths as Cisco Systems, General Electric, IBM, and Verizon Communications. What’s lacking is the codification of industry standards for the IoT, as many companies have aligned with groups that have competing agendas and... » read more

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