D2S’ Leo Pang talks with Semiconductor Engineering about lithography, inverse lithography, photomasks, where the problems are, and what needs to be done to move forward.
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The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.
China restricts U.S. processors; Samsung's CXL, DRAM module and roadmap; ASML's $2.7B retention bonus; U.S., Mexico partner up; Keysight's $1.5B offer to Spirent; Lam's new pulsed laser deposition; new OSAT center.
Virtual representations will improve performance and productivity across the entire design through manufacturing flow, but deployments will vary in effectiveness and timelines.
Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.
Verifying a processor is much more than making sure the instructions work, but the industry is building from a limited knowledge base and few dedicated tools.
The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.
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