Looming Issues And Tradeoffs For EUV


Momentum is building for extreme ultraviolet (EUV) lithography, but there are still some major challenges to solve before this long-overdue technology can be used for mass production. [gettech id="31045" comment="EUV"] lithography—a next-generation technology that patterns tiny features on a chip—was supposed to move into production around 2012. But over the years, EUV has encountered se... » read more

Challenges Mount For Photomasks


Semiconductor Engineering sat down to discuss photomask technologies with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP); Banqiu Wu, principal member of the technical staff and chief technology officer of the Mask and TSV Etch Division at [getentity id="22817" e_name="Applied Materials"]; Weston Sousa, general manager of the Reticle Products Division at [getentity id="22876" commen... » read more

Blog Review: Sept. 20


Mentor's Jeff Miller warns that MEMS accelerometers are vulnerable to takeover using specially constructed sound waves, as demonstrated in a new paper. Synopsys' Pooja Gupta and Srinivas Vijayaragavan explain some major technology updates in SAS 24G with a look at Binary primitives, Extended Binary primitives and primitive parameters. Cadence's Paul McLellan shares highlights from TSMC's ... » read more

Survey: Optimism Grows for EUV


The optimism is growing for extreme ultraviolet (EUV) lithography in the market, according to a pair of new surveys released by the eBeam Initiative, which also revealed some new and surprising data about mask writing tools and other photomask technology. In one of the surveys from the [getentity id="22818" e_name="eBeam Initiative"], respondents revealed that they are more optimistic than e... » read more

Getting Ready For EUV


The highly anticipated introduction of extreme ultra-violet (EUV) lithography is reflected in recent surveys conducted by the eBeam Initiative, which will be presented on Sept. 11 at the annual Photomask Technology Symposium in Monterey, Calif.  There are many changes are coming to the mask industry, in addition to EUV. Those include greater use of inverse-lithography technologies (ILT) and... » read more

The Secret Life Of Accelerators


Accelerator chips increasingly are providing the performance boost that device scaling once provided, changing basic assumptions about how data moves within an electronic system and where it should be processed. To the outside world, little appears to have changed. But beneath the glossy exterior, and almost always hidden from view, accelerator chips are becoming an integral part of most des... » read more

What’s After FinFETs?


Chipmakers are readying their next-generation technologies based on 10nm and/or 7nm finFETs, but it's still not clear how long the finFET will last, how long the 10nm and 7nm nodes for high-end devices will be extended, and what comes next. The industry faces a multitude of uncertainties and challenges at 5nm, 3nm and beyond. Even today, traditional chip scaling continues to slow as process ... » read more

The Week In Review: Manufacturing


Fab equipment ASML posted strong sales in the quarter and is apparently nearly sold out of scanners based on extreme ultraviolet (EUV) lithography, according to analysts. “ASML posted strong 2Q results and 2Q guidance, providing further evidence that demand remains high for semiconductor equipment,” said Weston Twigg, an analyst with KeyBanc Capital Markets, in a research note. “Demand d... » read more

Mask Modeling In The EUV Era


D2S reviews the challenges of mask modeling in the EUV era, including the need for dose/shape separation and mid-range correction, and the impact of GPU acceleration. https://youtu.be/iVqkoVMbK4o » read more

New BEOL/MOL Breakthroughs?


Chipmakers are moving ahead with transistor scaling at advanced nodes, but it's becoming more difficult. The industry is struggling to maintain the same timeline for contacts and interconnects, which represent a larger portion of the cost and unwanted resistance in chips at the most advanced nodes. A leading-edge chip consists of three parts—the transistor, contacts and interconnects. The ... » read more

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